Study on the crystallization process of Ni P amorphous alloy

Li, Hexing; Chen, Hai-Ying; Dong, Shihui; Yang, Jie; Deng, Jing‐Fa

doi:10.1016/s0169-4332(97)00379-6

Cited by 62 publications

(37 citation statements)

References 10 publications

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“…There are no significant compositional changes during crystallization. [21] The P content of the electroless Ni layer used in this work was measured to be about 12 at% in the very fine grain region near the Cu substrate. Figure 7 is a cross-sectional TEM micrograph of the interface between the eutectic Au-Sn solder and the electroless Ni in the assolidified bump.…”

Section: B Detailed Interface Microstructurementioning

confidence: 86%

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The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Song

Ahn

Morris

2001

J. Electron. Mater.

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In this work we studied the initial microstructure and microstructural evolution of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au. The solder bumps were 150-160 µm in diameter and 45-50 µm tall, reflowed on Cu/electroless Ni/Au, and then aged at 200 o C for up to 365 days. In addition, Au-Ni-Sn-alloys were made and analyzed to help identify the phases that appear at the interface during aging.The detailed interfacial microstructure was observed using TEM. The results show that the introduction of Au from the substrate produces large islands of ζ-phase in the bulk microstructure during reflow. Two Au-Ni-Sn compounds are formed at the solder/substrate interface and grow slowly during aging. The maximum solubility of Ni in the ζ-phase was measured to be about 1 at.% at 200°C, while Ni in the δ-phase is more than 20 at.%. The electroless Ni layer is made of several sublayers with slightly different compositions and microstructures. There is, in addition, an amorphous interaction layer at the solder/electroless Ni interface.

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Section: B Detailed Interface Microstructurementioning

confidence: 86%

“…[20][21] In general, as-plated electroless Ni(Ni-P) layer is amorphous at high P contents (P greater than about 10 at.%) and tends to crystallize on annealing. There are no significant compositional changes during crystallization.…”

Section: B Detailed Interface Microstructurementioning

confidence: 99%

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Song

Ahn

Morris

2001

J. Electron. Mater.

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“…The curves revealed a progressive increase of corrosion potential accompanied by thedecrease of anodic current density, indicating the improvement of corrosion resistance with increasing annealing temperature. It is evident from previous research works that nickel based alloy coatings have preferential dissolution of nickel which occurs at opencircuit potential, leading to the enrichment of phosphorus on the surface layer [8][9][10]. Then the enriched phosphorus surface reacts with water to form a layer of adsorbed hypophosphite anions (H 2 PO 2-).…”

Section: Coating Surface Morphologies and Elemental Compositionmentioning

confidence: 99%

“…At higher temperature (approximately 370 °C), the heat treatment caused precipitation of Ni 3 P phase along with its metastable forms, which eventually enhances the adhesion bonding between the coatings and the substrate [6], this aspect to the best knowledge of the authors has received very little or no attention from researchers so far. The purpose of the duplex Ni-W-P layer on Ni-P coating can be explained by the fact that Ni-W-P has better properties in terms of corrosion and wear than Ni-P which in turns, has better adhesion/contact with the mild steel substrate, so that it acts as better intermediate layer [7][8][9]. The improved corrosion resistance of this coating is due largely to the huge amount of grain boundary diffusion paths provided by the nanostructure of the Ni 3 P and crystalline Ni at high temperature, caused by the furnace annealing especially if air cooled, which favored the formation of the dense nickel-tungsten and nickel oxide films on the surface [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Deposition and Electrochemical Corrosion Behavior of Electroless Ni-P/Ni-W-P Duplex Plating on Mild Steel Substrate

Razaq¹,

Zhu²,

Liu³

2014

JMSE-B

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Abstract:The emergence of electroless Ni-P based ternary coatings and consequence duplex deposition possibilities, now offer more excellent corrosion and functional properties in acidic and alkaline environment. In this study, medium and high phosphorus Ni-P and duplex Ni-W-P coatings were produced and sequentially deposited on mild steel using plating baths with 10 g/L and 25 g/L of sodium hypophosphite as reducing agent (RA) with composition of the resulting deposits to be 91.5 Ni: 8.5 P and 87.6 Ni: 12.4 P, respectively. From the field-emission scanning electron microscope (FE-SEM) examination, the deposit morphology was found to change from nodular with some surface porosity to become more dense and smoother after heating treatment between 200-600 °C. The cross-section reveals firm adhesion of the as-plated and the merging of the top duplex layers of the heat treated sample as a result of tungsten diffusion. The potentiodynamic polarization test shows that the coating demonstrated significant improvement of corrosion resistance in 3.5% NaCl solution with optimum performance at 600 °C. The noted improved corrosion resistance of the coating came as a result of annealing which strengthened the layer and broaden its application.

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“…[85] It has been found that the P content and the thermal history determine the structure and properties of the electroless Ni layer. [108][109][110][111][112][113][114][115] In general, as-plated electroless Ni(Ni-P) layer is amorphous at high P contents (P greater than about 10 at.%) and tends to undergo self (or thermal)-crystallization on annealing. There are no significant compositional changes during crystallization.…”

Section: Detailed Interface Microstructure Of Solder Bumpmentioning

confidence: 99%

Microstructural evolution of eutectic Au-Sn solder joints

Song

2002

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Current trends toward miniaturization and the use of lead(Pb)-free solders in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability. The study particularly concentrated on the effects that the joint size and the type of substrate metallization have on both the bulk and interface microstructures of the joints. The systems studied were eutectic Au-Sn on Cu and Cu/electroless Ni/Au and for each system, two sets of sample geometries were used. The solubility characteristics and diffusional behavior of substrate metals into eutectic Au-Sn solder determines the detailed microstructure and microstructural evolution of the ultrafine eutectic Au-Sn joints. Two important things to be noted from the results are as follows: First, the overall microstructures of these joints are very coarse with respect to the size of joint, and hence the properties of the joints cannot be assumed from bulk solder data. Second, despite having a nominally similar starting eutectic Au-Sn composition, the microstructural features of the joints are unique for a given substrate metallization. Both of these results should be take into consideration during the design of reliable eutectic Au-Sn solder joints.

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Study on the crystallization process of Ni P amorphous alloy

Cited by 62 publications

References 10 publications

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Deposition and Electrochemical Corrosion Behavior of Electroless Ni-P/Ni-W-P Duplex Plating on Mild Steel Substrate

Microstructural evolution of eutectic Au-Sn solder joints

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