2008
DOI: 10.1088/0022-3727/41/19/195205
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Study on the influence of nitrogen on titanium nitride in a dc post magnetron sputtering plasma system

Abstract: The characteristics of direct current (dc) glow discharge plasma have been studied in a post magnetron device with an argon and nitrogen gas mixture. The introduction of nitrogen modifies the discharge leading to modifications of plasma parameters, transport mechanism and the cathode sheath. The electron energy distribution function, density and temperature profile are measured to characterize the discharge. Measured plasma potential profiles show the modification of the structure of the cathode sheath and con… Show more

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Cited by 17 publications
(13 citation statements)
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“…The same behavior of axial distribution of T e in argon dc glow discharge was noticed [10]. A confirmation of these results was obtained in the case of increasing the nitrogen ratio in glow discharge of nitrogen and argon gas mixture [6].…”
Section: Measurements Of the Electron Temperaturesupporting
confidence: 71%
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“…The same behavior of axial distribution of T e in argon dc glow discharge was noticed [10]. A confirmation of these results was obtained in the case of increasing the nitrogen ratio in glow discharge of nitrogen and argon gas mixture [6].…”
Section: Measurements Of the Electron Temperaturesupporting
confidence: 71%
“…Also the ionization potential of hydrogen gas (13.6 eV) is lower than that of nitrogen gas (14.6 eV), this difference appears in the increasing of T e by increasing of H 2 ratio. A confirmation of these results was obtained in the case of increasing the oxy gen ratio in glow discharge of oxygen and argon gas mixture [4,6].…”
Section: Measurements Of the Electron Temperaturesupporting
confidence: 57%
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“…The externally applied magnetic field traps the energetic electrons and effectively increases the ionization efficiency resulting in high deposition rate at a relatively low pressure [5,6], thereby making it a favourable process for many manufacturing applications. Generally, films are grown under low pressure to reduce collision events for higher surface mobility to ensure better quality of the deposited films [7][8][9]. In many plasma processing applications, magnetron reactive sputtering is actively used where metal oxides or metal nitride films are required for surface treatment.…”
Section: Introductionmentioning
confidence: 99%