2014
DOI: 10.1016/j.proeng.2013.11.047
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Study on the Mechanical Alloying Process for Preparing Ag/LSCO Electrical Contact Material

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Cited by 8 publications
(1 citation statement)
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“…Gao et al [ 22 ] reported that θ’ precipitation in an Al-Cu thin-film alloy could boost the interconnects’ electromigration lifetime and raise the alloy’s strength thanks to a stronger bond net. The Al-Ag binary alloys, on the other hand, are mostly utilized as diverse electrical contacts for application in plates or wire [ 23 ]. In order to improve the alloys’ thermal stability, stress-corrosion cracking and mechanical properties, a moderate amount of Ag addition could have a significant impact [ 24 ].…”
Section: Introductionmentioning
confidence: 99%
“…Gao et al [ 22 ] reported that θ’ precipitation in an Al-Cu thin-film alloy could boost the interconnects’ electromigration lifetime and raise the alloy’s strength thanks to a stronger bond net. The Al-Ag binary alloys, on the other hand, are mostly utilized as diverse electrical contacts for application in plates or wire [ 23 ]. In order to improve the alloys’ thermal stability, stress-corrosion cracking and mechanical properties, a moderate amount of Ag addition could have a significant impact [ 24 ].…”
Section: Introductionmentioning
confidence: 99%