This study investigated a new category of transparent encapsulant materials for light-emitting diodes (LEDs). It comprised a phenyl group that contained siloxane-modified epoxy (SEP-Ph) hybridized with a cyclic tetrafunctional siloxane-modified epoxy (SEP-D4) with methylhexahydrophthalic anhydride (MHHPA) as a curing agent. The SEP-Ph/SEP-D4 = 0.5/0.5 (sample 3) and SEP-D4 (sample 4) could provide notably high optical transmittance (over 90% in the visible region), high-temperature discoloration resistance, low stress, and more crucially, noteworthy sulfurization resistance. The lumen flux retention of the SEP encapsulated surface mounted device LEDs remained between approximately 97% and 99% after a sulfurization test for 240 h. The obtained comprehensive optical, mechanical, and sulfurization resistance proved the validity and uniqueness of the present design concept with complementary physical and chemical characteristics.Polymers 2020, 12, 21 2 of 11 of anhydride hardener and accelerator [14,15]. Huang et al. developed a series of cyclic silicone epoxies with various numbers of epoxy groups. By curing with aluminum acetylacetonate (Al(acac) 3 ) and diphenylsilanediol (Ph 2 Si(OH) 2 ), enhanced ultraviolet stability was achieved compared with an anhydride-cured cycloaliphatic epoxy [16]. Hue et al. prepared a transparent composition using the diglycidyl ether of bisphenol A and a phenylmethylsiloxane-modified epoxy (PMSE) hybrid resin. Curing with methylhexahydrophthalic anhydride (MHHPA) revealed that the addition of an appropriate amount of PMSE could effectively improve high-temperature thermal stability, dynamic mechanical stability, and performance of LEDs [18].Currently, surface mounted device LEDs (SMD LEDs) are advancing and their packages are becoming smaller and thinner. This allows harmful contaminants in the atmosphere such as hydrogen sulfide (H 2 S) to easily permeate an LED's package through its transparent encapsulation material.In this case, the bottom silver electrodes would darken because of the formation of silver sulfide, which would be accompanied by a significant decrease in the LED's light output. Although transparent epoxy-based encapsulants exhibit suitable gas barrier properties, the high thermal stress of epoxy resins that is generated during the soldering or temperature-cycling process would cause catastrophic damage. By contrast, silicone materials possess relatively low thermal stress compared with conventional epoxy resins, but their higher gas permeation properties would pose a problem for thin SMD LED packages, especially in outdoor applications.Many research studies have been conducted to enhance the gas barrier properties of transparent polymers, one of which added nanoscale lamellar fillers with a large aspect ratio, such as clay or graphene, into the polymer matrix [19,20]. The addition of clay can alter and extend the gas molecule diffusion pathway; furthermore, the incorporation of graphene can effectively prevent gas molecules from permeating into the polymer matrix; ho...