Study on the synthesis and thermal stability of silicone resins reinforced by Si–O–Ph cross-linking

Zhang, Huadong; Yan, Zhongyi; Yang, Zhizhou; Yao, Jinshui; Mu, Qiuhong; Peng, Dan; Zhao, Hui

doi:10.1039/d1ra05524k

Cited by 9 publications

(1 citation statement)

References 38 publications

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“…Silicone resin has great adjustability that could easily enhance or change its properties by adjusting organic groups. Usually, a phenyl group could be used to improve the thermal stability [7], fluorine [8] and ureido radical [9] could be used to enhance the tracking resistance, and noble metal [10][11][12] could also be used to increase the photoelectric and magnetic effect. Due to this, silicone resin has been widely studied as low-k [13,14] and high-k [15,16] material in recent years.…”

Section: Introductionmentioning

confidence: 99%

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Wei

et al. 2023

Polymers

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Based on the excellent physical properties and flexible molecular modifiability, modified silicone resins have received favorable attention in the field of microelectronics, and recently a number of modified silicone resins have appeared while few breakthroughs have been made in low dielectric constant (low-k) materials field due to the limitations of structure or the curing process. In this work, functional silicone resin with different BCB contents was prepared with two monomers. The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T5% = 495.0 °C) after curing. Significant performance changes were observed with the increase in BCB structural units, and the functional silicone obtained does not require melting and dissolution during processing because of good fluidity at room temperature. Moreover, the mechanical properties of silicone resins can be also controlled by adjusting the BCB content. The obtained silicone resins could be potentially used in the field of electronic packaging materials.

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Section: Introductionmentioning

confidence: 99%

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Wei

et al. 2023

Polymers

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Nitrogen-Coordinated borate esters induced entangled heterointerface toward multifunctional Silicone/Phenolic binary aerogel composites

Liu,

Jiang,

Qian

et al. 2024

Chemical Engineering Journal

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Evaluating two stages of silicone-containing arylene resin oxidation via experiment and molecular simulation

Cai,

Huang,

Chen

et al. 2024

Chinese Journal of Chemical Engineering

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Study on the synthesis and thermal stability of silicone resins reinforced by Si–O–Ph cross-linking

Abstract: A novel silicone resin (SR-OH) containing phenolic hydroxyl (Ph–OH) groups was designed and synthesized via co-hydrolysis/condensation and catalytic hydrogenation.

Cited by 9 publications

References 38 publications

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Nitrogen-Coordinated borate esters induced entangled heterointerface toward multifunctional Silicone/Phenolic binary aerogel composites

Evaluating two stages of silicone-containing arylene resin oxidation via experiment and molecular simulation

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