Study on the vapor chamber with refrigerant R-141b as working fluid for HDD cooling

Naphon, Paisarn; Wiriyasart, Songkran

doi:10.1016/j.icheatmasstransfer.2012.08.006

Cited by 20 publications

(7 citation statements)

References 17 publications

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“…It was found that the VC reduced the temperature of the HDD by almost 15.21%. Similar results were obtained by Naphon et al 39 for cooling the HDD by using the VC runs with de-ionized (DI) water and R-141b.…”

Section: Applications Of a Vapour Chambersupporting

confidence: 85%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

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Section: Applications Of a Vapour Chambersupporting

confidence: 85%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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“…The authors have developed a heat exchange and aerodynamic resistance CFD model for a radiator with lamellar-split fins, which can be used in air cooling systems for various electronic devices. In particular, the obtained results can be useful in the cooling systems of central processor devices and other powerful electronic components [60,61], power amplifiers for transmitting modules of radar systems [62], promising energy-saving solid-state light sources [63][64][65][66], and rocket and space electronics devices [67,68]. Received 8 December 2018…”

Section: Discussionmentioning

confidence: 99%

Archives of Thermodynamics

Nikolaenko,

Baranyuk,

Rohachov

et al. 2020

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Promising cooling systems for high-power electronic elements are those based on vapor chambers and heat pipes which allow for the local heat flow to be dispersed from the electronic element to a larger surface area of the vapor chamber or the heat pipe. To reduce the thermal resistance of the cooling system, a finned radiator is installed on the outer surface of the vapor chamber or heat pipe. The authors propose a new design of the radiator which increases the heat transfer efficiency. The paper presents results of numerical simulation of heat transfer and aerodynamic resistance of the heat transfer surface with lamellar-split finning. The comparative analysis of heat transfer and aerodynamics was carried out for three types of radiators: with lamellar smooth finning, with lamellar split finning and with the sections of split finning rotated 30 • against the air flow. It is shown that cutting the fins and rotating the split sections leads to an increase in heat transfer intensity and increase in aerodynamic resistance. The obtained results may be useful in the design of cooling systems for computer processors, power amplifiers for transmitting modules, energy-saving solid-state light sources, etc.

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“…The operation of a VCHS is reduced when operating in sub-zero conditions, where freezing of the working fluid prohibits the vapour cycle and protects avionic components from over cooling. Most importantly the implementation of an embedded VCHS within an avionic chassis offers minimal disruption to conduction to cold wall cooling technique 13,14,15 . The aim of this investigation is to experimentally assess the application of this technology when coupled to multiple heat sources embedded within a representative real world avionic chassis.…”

Section: B Vapour Chamber Heat Spreadersmentioning

confidence: 99%