Study on thermal conductive epoxy adhesive based on adopting hexagonal boron nitride/graphite hybrids

Kumar, Rajesh; Nayak, Sagar Kumar; Sahoo, Swarnalata; Panda, Bishnu P.; Mohanty, Smita; Nayak, Sanjay K.

doi:10.1007/s10854-018-9788-3

Cited by 28 publications

(29 citation statements)

References 29 publications

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“…This is because of the formation of long-range 3D conducting networks for phonon transfers inside the filler-matrix system and effect of h-BN on TC of hybrid composites, as the synergistic effect of h-BN with GO and RGO was quite appreciable. Low TC attributed to the formation of less effective three-dimensional percolation paths [18]. This is in accordance with Rajesh Kumar et al They described that the effect of 30 wt% of h-BN on 30 wt% graphite powder is so synergistic and that the TC reached to 2.02 W/mK [18].…”

Section: Ftir Analysissupporting

confidence: 71%

“…Low TC attributed to the formation of less effective three-dimensional percolation paths [18]. This is in accordance with Rajesh Kumar et al They described that the effect of 30 wt% of h-BN on 30 wt% graphite powder is so synergistic and that the TC reached to 2.02 W/mK [18]. Effect of 10 wt% BN with 5 wt% graphene on the epoxy is described by A. K. Singh et al They demonstrated the TC value at this loading was 1.6 W/mK [37].…”

Section: Ftir Analysismentioning

confidence: 99%

“…Therefore, the interfacial phonon scattering and thermal resistance inside the epoxy are reduced efficiently. It was also cited that due to the iso-structure of h-BN and RGO, the compatibility between two hybrid particles enhances [18,19].…”

Section: Ftir Analysismentioning

confidence: 99%

“…As the modified h-BN has the ability for better dispersion within the matrix, the tensile strength has increased, and consequently, mh-BN/GO4/epoxy hybrid composite showed improved lap shear strength of 8.1 MPa with respect to mh-BN/RGO4/epoxy hybrid composite with lap shear strength of 7.6 MPa. This was also due to the compatibility of GO and mh-BN as they are iso-structure and having more number of functional groups which can bind filler with matrix effectively and hybrid composites with substrate [18].…”

Section: Analytical Modelsmentioning

confidence: 99%

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Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Nayak

Mohanty

2019

SN Appl. Sci.

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In recent years, significant interest has been focused on fabricating epoxy-based hybrid composite with a high thermal conductivity at optimum filler loading. As epoxy usually has a low thermal conductivity, the high intrinsic thermal conducting fillers such as h-BN, GO and RGO are incorporated. In this research, we report the epoxy-based hybrid composites with an enhanced thermal conductivity through silane-modified h-BN (mh-BN) with RGO. The sample containing 44.5 wt% (40 wt% mh-BN and 4.5 wt% RGO) hybrid filler exhibited the highest thermal conductivity (1.416 W/mK) which was 7 times that of pristine epoxy (0.21 W/mK). The thermal conductivities of RGO with unmodified h-BN (0.789 W/mK), GO with mh-BN (0.769 W/mK) and GO with unmodified h-BN (0.713) at 44.5 wt% loading are also reported. Comparison property studies of these above-mentioned four hybrid composites are described by lap shear strength, flexural strength, impact strength and thermogravimetric analysis. The fabricated hybrid composites exhibit outstanding performance in lap shear strength, thermal stability, and slightly reduced impact and flexural strength, which makes it as relevant for electronics packaging application such semiconductors, integrated circuit packaging, optoelectronics and also can attest potentiality in structural energy storage application. The atomic force microscopy and scanning electron microscopy verified the surface roughness and morphology of two optimized compositions, i.e., mh-BN with RGO and h-BN with RGO with the epoxy matrix. Also, Maxwell, Hashin-Shtrikmann and series equations are used to verify the obtained experimental value.

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Section: Ftir Analysissupporting

confidence: 71%

Section: Ftir Analysismentioning

confidence: 99%

Section: Ftir Analysismentioning

confidence: 99%

Section: Analytical Modelsmentioning

confidence: 99%

See 2 more Smart Citations

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Nayak

Mohanty

2019

SN Appl. Sci.

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“…However, a certain range in the size distribution of FLG fillers turned out to be even beneficial. The size distribution of the fillers can result in the “synergistic” effect, characteristic for the fillers of different dimensions . The “synergistic” effects constitutes a stronger enhancement of the thermal conductivity of the composites with the size‐dissimilar binary fillers than with the individual fillers of the same total concentration .…”

Section: Introductionmentioning

confidence: 99%

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Barani

Mohammadzadeh

Geremew

et al. 2019

Adv Funct Materials

225

160

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The thermal properties of epoxy‐based binary composites comprised of graphene and copper nanoparticles are reported. It is found that the “synergistic” filler effect, revealed as a strong enhancement of the thermal conductivity of composites with the size‐dissimilar fillers, has a well‐defined filler loading threshold. The thermal conductivity of composites with a moderate graphene concentration of fg = 15 wt% exhibits an abrupt increase as the loading of copper nanoparticles approaches fCu ≈ 40 wt%, followed by saturation. The effect is attributed to intercalation of spherical copper nanoparticles between the large graphene flakes, resulting in formation of the highly thermally conductive percolation network. In contrast, in composites with a high graphene concentration, fg = 40 wt%, the thermal conductivity increases linearly with addition of copper nanoparticles. A thermal conductivity of 13.5 ± 1.6 Wm−1K−1 is achieved in composites with binary fillers of fg = 40 wt% and fCu = 35 wt%. It has also been demonstrated that the thermal percolation can occur prior to electrical percolation even in composites with electrically conductive fillers. The obtained results shed light on the interaction between graphene fillers and copper nanoparticles in the composites and demonstrate potential of such hybrid epoxy composites for practical applications in thermal interface materials and adhesives.

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A Bioinspired Polymer‐Based Composite Displaying Both Strong Adhesion and Anisotropic Thermal Conductivity

Zhang

et al. 2023

Adv Funct Materials

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The integration and functionality of high-power electronic architectures or devices require a high strength and good heat flow at the interface. However, simultaneously improving the interfacial bonding and phonon transport of polymers is challenging because of the tradeoff between the cross-linked flexible chains and high-quality crystalline structure. Here, a copolymer, poly(dopamine methacrylate-co-hydroxyethyl methacrylate [P(DMA-HEMA)] is designed and synthesized, inspired by the snail and mussel adhesion. The copolymer achievs a high surface adhesion up to 6.38 MPa owing to the synergistic effects of hydrogen bonds and mechanical interlocking. When the copolymer is introduced into vertically aligned carbon nanotubes (VACNTs), the catechol groups in P(DMA-HEMA) formed strong bonding with the nanotubes through π-π interactions at the interface. As a result, the P(DMA-HEMA)/VACNTs composite shows a high through-plane thermal conductivity (21.46 W m −1 K −1 ), an in-plane thermal conductivity that is 3.5 times higher than that of pristine VACNTs, and an extremely low thermal contact resistance (20.27 K mm 2 W −1 ). Furthermore, the composite forms weld-free high-strength connections between two pieces of various metals to bridge directional thermal pathways. It also exhibits excellent interfacial heat transfer capability and high reliability even under zero-pressure conditions.

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Study on thermal conductive epoxy adhesive based on adopting hexagonal boron nitride/graphite hybrids

Cited by 28 publications

References 29 publications

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

A Bioinspired Polymer‐Based Composite Displaying Both Strong Adhesion and Anisotropic Thermal Conductivity

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