2019
DOI: 10.1016/j.solmat.2019.109978
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Studying dopant diffusion from Poly-Si passivating contacts

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Cited by 61 publications
(34 citation statements)
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“…The doping profile in the poly-Si layer and at the surface of the c-Si substrate is known to play a role in the final surface passivation properties of the poly-Si/SiOx contact [17,32].…”
Section: Variation Of the Doping Profile With Increasing Annealing Temperaturementioning
confidence: 99%
“…The doping profile in the poly-Si layer and at the surface of the c-Si substrate is known to play a role in the final surface passivation properties of the poly-Si/SiOx contact [17,32].…”
Section: Variation Of the Doping Profile With Increasing Annealing Temperaturementioning
confidence: 99%
“…Prominent is the peak at the position of the thermally grown SiO x at the poly-Si/c-Si interface. It is known that SiO x is a diffusion barrier for P and that P piles up at such oxides [19], [20], which was also previously observed for TOPCon structures [18], [21]. However, quantitative analysis of the peak at the poly-Si/SiO x interface is difficult due to the so-called SIMS matrix effect, which describes the enhancement of ion yield resulting from the presence of oxygen or cesium [22], [23].…”
Section: A Standard P/n Sitjmentioning
confidence: 81%
“…The diffusion of P into the absorber at the poly-Si(n + )/SiO x /c-Si(n) interface, which supports the surface passivation [18], was defined by the FA and hardly changed by the RTP. Within c-Si, the P profiles were very similar independent of T RTP .…”
Section: A Standard P/n Sitjmentioning
confidence: 84%
“…For passivating contacts based on poly-Si alloy, the doping level within the poly-Si alloy layer and the doping profile across the poly-Si alloy/SiO x /c-Si interface are the main factors influencing the quality of the field-effect passivation. 53 There are some parameters that can control the doping level and profile for such PECVD prepared passivating contacts: (i) the phosphorus or boron content in the PECVD a-SiO x :H layers, (ii) the thicknesses of the intrinsic and doped PECVD a-SiO x :H layers, (iii) the thermal budget of high-temperature annealing process, and (iv) the thickness and quality of the ultrathin SiO x layers.…”
Section: Influence Of Doping Ratiomentioning
confidence: 99%