Of the attributes that determine the performance of electroactive
film-based devices, the least well quantified and understood is the
spatial distribution of the component species. This is critical since
it dictates the transport rates of
all
the mobile
species (electrons, counterions, solvent, analyte, and reactant) and
the film mechanical properties (as exploited in actuator devices).
One of the few techniques able to provide individual species population
profiles
in situ
is specular neutron reflectivity
(NR). Historically, this information is obtained at the cost of poor
time resolution (hours). Here we show how NR measurements with
event mode
data acquisition enable both spatial
and
temporal resolution; the latter can be selected postexperiment
and varied during the transient. We profile individual species at
“buried” interfaces under dynamic electrochemical conditions
during polypyrrole electrodeposition and Cu deposition/dissolution.
In the case of polypyrrole, the film is homogeneous throughout growth;
there is no evidence of dendrite formation followed by solvent (water)
displacement. Correlation of NR-derived film thickness and coulometric
assay allows calculation of the solvent volume fraction, ϕ
S
= 0.48. In the case of Cu in a deep eutectic solvent, the
complexing nature of the medium results in time-dependent metal speciation:
mechanistically, dissolution does not simply follow the deposition
pathway in reverse.