1988
DOI: 10.1007/978-1-4899-2382-0_11
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Submicron Lithography

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Cited by 3 publications
(2 citation statements)
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“…8 Following coating with the first PMMA layer ͑BDH 8%͒ and baking at 180°C for 90 min, the second layer ͑ELV 4%͒ is spun on and baked, usually for about 16 h, at 180°C. 8 Following coating with the first PMMA layer ͑BDH 8%͒ and baking at 180°C for 90 min, the second layer ͑ELV 4%͒ is spun on and baked, usually for about 16 h, at 180°C.…”
Section: B Patterning For Element Definitionmentioning
confidence: 99%
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“…8 Following coating with the first PMMA layer ͑BDH 8%͒ and baking at 180°C for 90 min, the second layer ͑ELV 4%͒ is spun on and baked, usually for about 16 h, at 180°C. 8 Following coating with the first PMMA layer ͑BDH 8%͒ and baking at 180°C for 90 min, the second layer ͑ELV 4%͒ is spun on and baked, usually for about 16 h, at 180°C.…”
Section: B Patterning For Element Definitionmentioning
confidence: 99%
“…8 As noted above, the pattern in resist is overcoated by a thin layer of metal ͑preferably of thickness one-third or less of the thickness of the resist͒ and placed in a strong solvent to dissolve the resist and leave the required metal pattern on the substrate. In the former, a lithographic method is used to define the required pattern in a resist on the substrate of interest followed by film deposition and lift off.…”
Section: Introductionmentioning
confidence: 99%