“…[6,8,13,[17][18][19][23][24][25] But due to its limited electrical and optical properties of pure MoS 2 , a universal metal doping method to control its performance is urgently needed. [26][27][28] In fact, many methods, including surface engineering, [29] plasma treatment, [30] molecular adsorption with charge transfer, [27] chemical doping, [31][32][33] and metal work-function engineering [34,35] are dedicated to realizing metal doping. [27,28,[36][37][38] However, these methods bring about some inevitable disadvantages, such as uncontrollability, degraded performance, complicated process, harsh doping conditions, and difficulty in large-area preparation.Ion implantation technology has been generally used in industrial semiconductor applications.…”