Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Wood, Michael G.; Bahr, Matthew; Gutierrez, Jordan E.; Anderson, Evan M.; Finnegan, Patrick Sean; Scott, Weatherred,; Martinez, William M.; Hummell, Courtney L.; Reyna, Robert; Arterburn, Shawn; Friedmann, T. A.; Hawkins, Samuel D.; Patel, Victor J.; Hendrickson, Alex; Klem, John F.; Long, Cheryl; Olesberg, J. T.; Shank, Joshua C.; Chumney, D.; Looker, Quinn

doi:10.1364/cleo_si.2023.sth3h.5

Cleo 2023 2023

DOI: 10.1364/cleo_si.2023.sth3h.5

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Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Michael G. Wood¹,

Matthew Bahr²,

Jordan E. Gutierrez³

et al.

Abstract: We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

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Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers

Abstract: We report on a two-step technique for post-bond III-V substrate removal involving precision mechanical milling and selective chemical etching. We show results on GaAs, GaSb, InP, and InAs substrates and from mm-scale chips to wafers.

Cited by 0 publications

References 3 publications

No citations

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