Proceedings of the 2005 Conference on Asia South Pacific Design Automation - ASP-DAC '05 2005
DOI: 10.1145/1120725.1120806
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Substrate resistance extraction with direct boundary element method

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Cited by 5 publications
(11 citation statements)
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“…For a structure (see Figure 1 of [17]), to make the compressing practical, we reorder the variable v 33 within the top layer as:…”
Section: Compress the Linear Systemmentioning
confidence: 99%
“…For a structure (see Figure 1 of [17]), to make the compressing practical, we reorder the variable v 33 within the top layer as:…”
Section: Compress the Linear Systemmentioning
confidence: 99%
“…In this paper, the direct boundary element method (DBEM) [12,13] is improved for efficient extraction of the parameters. DBEM is used to get the substrate resistance [12]. This is performed only one time.…”
Section: Introductionmentioning
confidence: 99%
“…in medium Mi (2) The potential and the conductance current are continuous across medium interfaces: 1 (4zcr), where r is the distance between point s and a source point [12]. q* is the normal derivative.…”
Section: Introductionmentioning
confidence: 99%
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“…High-speed digital components and highly-sensitive analog components are often built on a common substrate. Although the high integration has some advantages, such as low power dissipation [2], there is a problem that the current noises injected by digital components travel the shared substrate and impact sensitive analog components severely [3]. Besides, substrate losses also impact circuit performances considerably.…”
Section: Introductionmentioning
confidence: 99%