Substrate Trace Modeling for Package Warpage Simulation

Wang, Mingji; Wells, Brendan C.

doi:10.1109/ectc.2016.199

Cited by 28 publications

(2 citation statements)

References 4 publications

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“…The ECAD TM method enables a more efficient and accurate representation of tiny, delicate, complex Cu traces, pads and vias surrounded by the PP dialectic material and the SM protective material on the coreless substrate and core interposer [18]. A flowchart of the ECAD TM method is shown in Figure 4.…”

Section: Linear Elastic Mechanicsmentioning

confidence: 99%

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

2021

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This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is introduced for effectively predicting the process-induced warpage. The mechanical FEA takes into account the viscoelastic behavior and cure shrinkage of the epoxy molding compound. In order to enhance the computational and modeling efficiency and retain the prediction accuracy at the same time, this study proposes a novel effective approach that combines the trace mapping method, rule of mixture and FEA to estimate the effective orthotropic elastic properties of the coreless substrate and core interposer. The study begins with experimental measurement of the temperature-dependent elastic and viscoelastic properties of the components in the assembly, followed by the prediction of the effective elastic properties of the orthotropic interposer and substrate. The predicted effective results are compared against the results of the ROM/analytical estimate and the FEA-based effective approach. Moreover, the warpages obtained from the proposed process simulation framework are validated by the in-line measurement data, and good agreement is presented. Finally, key factors that may influence process-induced warpage are examined via parametric analysis.

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Section: Linear Elastic Mechanicsmentioning

confidence: 99%

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

2021

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“…Where efficiency is concerned, RDL is divided into large-size regions, and there are three typical material equivalization methods. The first method, employed by Wang et al [ 25 ], involves calculating the isotropic materials based on the copper ratio within each region. The second method, used by McCaslin et al [ 26 ], is determining the anisotropic equivalent material properties of regions consisting of simple shape traces through composite material mechanics.…”

Section: Introductionmentioning

confidence: 99%

An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning

Wu,

Wang,

et al. 2023

Micromachines

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The decreasing-width, increasing-aspect-ratio RDL presents significant challenges to the design for reliability (DFR) of an advanced package. Therefore, this paper proposes an ML-based RDL modeling and simulation method. In the method, RDL was divided into blocks and subdivided into pixels of metal percentage, and the RDL was digitalized as tensors. Then, an ANN-based surrogate model was built and trained using a subset of tensors to predict the equivalent material properties of each block. Lastly, all blocks were transformed into elements for simulations. For validation, line bending simulations were conducted on an RDL, with the reaction force as an accuracy indicator. The results show that neglecting layout impact caused critical errors as the substrate thinned. According to the method, the reaction force error was 2.81% and the layout impact could be accurately considered with 200 × 200 elements. For application, the TCT maximum temperature state simulation was conducted on a CPU chip. The simulation indicated that for an advanced package, the maximum stress was more likely to occur in RDL rather than in bumps; both RDL and bumps were critically impacted by layouts, and RDL stress was also impacted by vias/bumps. The proposed method precisely concerned layout impacts with few resources, presenting an opportunity for efficient improvement.

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Advanced FOPoP technology in heterogeneous integration: Finite element analysis with element birth and death technique

Wu,

2025

Simulation Modelling Practice and Theory

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Substrate Trace Modeling for Package Warpage Simulation

Cited by 28 publications

References 4 publications

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning

Advanced FOPoP technology in heterogeneous integration: Finite element analysis with element birth and death technique

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