Subsurface damage in alumina induced by single-point scratching

Zarudi, I.; Zhang, L.; W., Y.

doi:10.1007/bf00352889

Cited by 36 publications

(14 citation statements)

References 10 publications

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“…However, because of their low fracture toughness, it is difficult to obtain high quality surfaces of brittle materials by a conventional machining method. Studies have shown that to prevent the fracture-caused damage, a brittle material should be machined in its ductile deformation mode [102][103][104][105][106][107]. In practice, the ductile-regime machining frequently remains uneconomical since the critical depth of cut is on the order of 1 lm or less, resulting in a small material removal rate and long machining time [3,108].…”

Section: Uva Cutting Of Brittle Materialsmentioning

confidence: 99%

Ultrasonic vibration-assisted machining: principle, design and application

Zhang

2015

Adv. Manuf.

145

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Ultrasonic vibration-assisted (UVA) machining is a process which makes use of a micro-scale high frequency vibration applied to a cutting tool to improve the material removal effectiveness. Its principle is to make the tool-workpiece interaction a microscopically non-monotonic process to facilitate chip separation and to reduce machining forces. It can also reduce the deformation zone in a workpiece under machining, thereby improving the surface integrity of a component machined. There are several types of UVA machining processes, differentiated by the directions of the vibrations introduced relative to the cutting direction. Applications of UVA machining to a wide range of workpiece materials have shown that the process can considerably improve machining performance. This paper aims to provide a comprehensive discussion and review about some key aspects of UVA machining such as cutting kinematics and dynamics, effect of workpiece materials and wear of cutting tools, involving a wide range of workpiece materials including metal alloys, ceramics, amorphous and composite materials. Some aspects for further investigation are also outlined at the end.

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Section: Uva Cutting Of Brittle Materialsmentioning

confidence: 99%

Ultrasonic vibration-assisted machining: principle, design and application

Zhang

2015

Adv. Manuf.

145

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“…30 µm diameter), basal twinning dominates the near surface deformation and dislocations can only be found very near the abraded surface (Inkson, 2000). Zarudi et al . (1998) studied scratch tracks on Al 2 O 3 surfaces, finding twinning, dislocation slip and cracking in the vicinity surrounding the scratches.…”

Section: Introductionmentioning

confidence: 99%

“…30 mm diameter), basal twinning dominates the near surface deformation and dislocations can only be found very near the abraded surface (Inkson, 2000). Zarudi et al (1998) studied scratch tracks on Al 2 O 3 surfaces, finding twinning, dislocation slip and cracking in the vicinity surrounding the scratches. Al 2 O 3 and Al 2 O 3 -SiC whisker composites machine ground with 126 mm diamond grits were observed to have residual deformation zones (dislocations and grain-boundary cracks) surfacelocalized to depths of only 1±2 mm, which corresponds to the grain size of both ceramics (Oden & Ericsson, 1996).…”

Section: Introductionmentioning

confidence: 99%

Subsurface deformation of machined Al₂O₃and Al₂O₃/5vol%SiC nanocomposite

Inkson

Roberts

2001

Journal of Microscopy

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Under machine grinding, material removal in monolithic Al2O3 is by intergranular fracture and grain pull‐out. In comparison, under the same grinding conditions, an Al2O3/5%SiC nanocomposite undergoes significant surface grooving and intragranular fracture. The subsurface deformation mechanisms were investigated by cross‐sectional transmission electron microscopy. For Al2O3, the residual deformation zone was localized very close to the surface in the first layer of grains, with dislocations occurring only within 1.5 µm of the top surface and a high density of basal twins penetrating to a depth of one single grain. Cracks were present along grain boundaries or basal twin interfaces. For Al2O3/SiC nanocomposites, the main residual plastic deformation is observed to be dislocations activated to a depth of about 10 µm (approx. 3–4 grains), with twinning rarely observed. Possible mechanisms by which the SiC particles influence the subsurface deformation and material removal modes are discussed.

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“…4B) included intersecting microgrooves (width < 1 μm) and focal pits with cross-sectional areas that ranged between 0.1 – 100 μm 2 . Both features likely arise from the polishing of the ceramic substrate, the discussion of which has been reviewed elsewhere (Zarudi et al, 1998; Ravikiran, 1999, 2000a, b). The ceramic-based sides and tip of the MEAs were composed of an extensive network of interconnected ridges and cavities, which contributed to a unique, rough appearance (Fig.…”

Section: Resultsmentioning

confidence: 99%

Ceramic-based microelectrode arrays: Recording surface characteristics and topographical analysis

Talauliker

Price

Burmeister

et al. 2011

Journal of Neuroscience Methods

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Amperometric measurements using microelectrode arrays (MEAs) provide spatially and temporally resolved measures of neuromolecules in the central nervous system of rats, mice and non-human primates. Multi-site MEAs can be mass fabricated on ceramic (Al2O3) substrate using photolithographic methods, imparting a high level of precision and reproducibility in a rigid but durable recording device. Although the functional capabilities of MEAs have been previously documented for both anesthetized and freely-moving paradigms, the performance enabling intrinsic physical properties of the MEA device have not heretofore been presented. In these studies, spectral analysis confirmed that the MEA recording sites were primarily composed of elemental platinum (Pt°). In keeping with the precision of the photolithographic process, scanning electron microscopy revealed that the Pt recording sites have unique microwell geometries post-fabrication. Atomic force microscopy demonstrated that the recording surfaces have nanoscale irregularities in the form of elevations and depressions, which contribute to increased current per unit area that exceeds previously reported microelectrode designs. The ceramic substrate on the back face of the MEA was characterized by low nanoscale texture and the ceramic sides consisted of an extended network of ridges and cavities. Thus, individual recording sites have a unique Pt° composition and surface profile that has not been previously observed for Pt-based microelectrodes. These features likely impact the physical chemistry of the device, which may influence adhesion of biological molecules and tissue as well as electrochemical recording performance post-implantation. This study is a necessary step towards understanding and extending the performance abilities of MEAs in vivo.

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Subsurface damage in alumina induced by single-point scratching

Cited by 36 publications

References 10 publications

Ultrasonic vibration-assisted machining: principle, design and application

Ultrasonic vibration-assisted machining: principle, design and application

Subsurface deformation of machined Al₂O₃and Al₂O₃/5vol%SiC nanocomposite

Ceramic-based microelectrode arrays: Recording surface characteristics and topographical analysis

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Subsurface damage in alumina induced by single-point scratching

Cited by 36 publications

References 10 publications

Ultrasonic vibration-assisted machining: principle, design and application

Ultrasonic vibration-assisted machining: principle, design and application

Subsurface deformation of machined Al2O3and Al2O3/5vol%SiC nanocomposite

Ceramic-based microelectrode arrays: Recording surface characteristics and topographical analysis

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Product

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Subsurface deformation of machined Al₂O₃and Al₂O₃/5vol%SiC nanocomposite