Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

Abstract

Subsurface damage (SSD) induced during abrasive grain machining process strongly influences the mechanical strength and subsurface quality of the brittle components. Therefore, it is meaningful to study the relationship between SSD and grinding parameters. The methods of theoretical analysis, numerical simulation and experimental testing are used to analyze the SSD of brittle materials in high-speed grinding. The results of numerical simulation are consistent with those of theoretical analysis and experimental testing, which indicates that the present numerical method is reasonable. The investigation focuses on the effects of wheel speed, grinding depth, and apex angle of the abrasive grain on the SSD of brittle materials. It shows that when maximum undeformed chip thickness (M-UCT) is greater than the critical thickness of brittle fracture, the material removal is mainly in the brittle mode. A high wheel speed is beneficial to achieving a good subsurface quality. However, under certain conditions, an ultra-high wheel speed with quite small grinding depth is not helpful in SSD control. Due to the kinematic characteristics of the grinding process, the effect of grinding depth on SSD is weaker than that of wheel speed and a smaller abrasive grain is of advantage to subsurface quality. In addition, the grinding force is one of the major factors influencing the subsurface quality.

Studies on the grinding force, size effect, surface texture, and mechanism of material removal in the grinding of AA6061-TiB2/ZrB2 in situ composite

“…15–17 Wear of the girt is re-sharpened by further process during grinding of hard materials. 18 Grinding force is an important response, which reflects the chip formation and surface integrity. 19 During the grinding process, grit makes physical contact with the workpiece and slides over the workpiece.…”

Subsurface Damage in Polishing Process of Silicon Carbide Ceramic

“…Blaineau et al obtained the relationship between SSD depth and grinding force by comparing experimental results with discrete element method simulation results [ 21 ]. Wang et al used the method of theoretical analysis, numerical simulation, and experimental testing to analyze the SSD during the high-speed grinding of brittle materials [ 22 ]. However, theoretical studies on the SSD of hard brittle materials in the polishing process have been reported with limited success, which is likely because the majority of existing studies rarely take systematic theoretical models for SSD and three-dimensional (3D) dynamic analysis into consideration.…”

High speed toughening-based ceramics grinding mechanism for quality and efficiency

“…In HSG process, the grinding wheel linear speed could reach up to higher than 120 m/s (Pang et al, 2018), compared with conventional turning or milling of about 10 m/s or less. Under this circumstance, the machining strain rate could be higher than 10 -5 /s (Wang et al, 2016), which will definitely cause a change of materials properties. Wang et al (2016) simulated the high speed grinding induced damages and cracks in BK7 glass grinding, which concluded that the effect of grinding depth is weaker than wheel speed and a smaller abrasive grain is advantageous to subsurface quality.…”

“…Under this circumstance, the machining strain rate could be higher than 10 -5 /s (Wang et al, 2016), which will definitely cause a change of materials properties. Wang et al (2016) simulated the high speed grinding induced damages and cracks in BK7 glass grinding, which concluded that the effect of grinding depth is weaker than wheel speed and a smaller abrasive grain is advantageous to subsurface quality. That was based on traditional finite element simulation method and the change of material properties have not been discussed in detail.…”