Subsurface nanocracking in monocrystalline Si (001) induced by nanoscratching

Tang, Feng; Zhang, Liangchi

doi:10.1016/j.engfracmech.2014.02.016

Cited by 31 publications

(8 citation statements)

References 43 publications

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“…5a, a high density of non-uniform dislocations accompanying with the lateral crack appeared and approximatly propagated to the depth of 0.52 μm. The crack manifested itself as 'a coarse band' due to Moiré fringes [19,20]. In this work, the lateral cracks emanated from the immediate bottom of the surface and fully extended to the adjoining surface of 0.6 μm in width.…”

Section: Original Subsurface Structure Of Rb-sicmentioning

confidence: 63%

“…It is apparent that the crack path was microscopically deflected over about 70℃ from the initial direction. Such reorientation might be related to the interaction with the emitted defects (e.g., dislocations [21]) when a crack approaches the last stage of its propagation, it may deviate away from the initial direction, suggesting the complexity of crack propagation [19].…”

Section: Original Subsurface Structure Of Rb-sicmentioning

confidence: 99%

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Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

Zhang

Luo

2018

Applied Surface Science

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This paper investigated the structural defects beneath the fracture area of 6H-SiC in reaction-bonded silicon carbide (RB-SiC) ceramics after ultra-precision grinding. The nano-indentation technique was used to evaluate the evolution of deformation behavior and find the critical transition condition among elastic, plastic and fracture. It was found that beneath the fracture pits, dislocations accompanied with micro-cracks (lateral and median) were the two types of subsurface damage. However, no amorphous phase was detected. In addition, a two-beam analysis confirmed that the dislocations were activated on basal and dissociated into the Shockley partial dislocations in 6H-SiC particle. The following indentation experiments revealed that the existence dislocations in the ground subsurface should be occurred earlier than cleavage. These dislocations were the predominant yielding mechanism in 6H-SiC, which initiated at a shear stress of about 23.4-28.4 Gpa through a pop-in event on load-displacement curve. Afterwards, cracks emerged when the maximum tensile stress beneath the indenter increased to 31.6 Gpa. It was identified that cracks could be activated under the intersection effect of non-uniform high density dislocations. Meanwhile, the blocking effect on sliding motion of dislocations caused by cross propagating dislocations, phase boundary and sintering agents play an important role in the evolution of fracture during grinding process. At last, the deformation behavior was further elaborated to discuss the slippage on the basal plane determined by Schmidt factor and structure characteristic of 6H-SiC.

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Section: Original Subsurface Structure Of Rb-sicmentioning

confidence: 63%

Section: Original Subsurface Structure Of Rb-sicmentioning

confidence: 99%

Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

Zhang

Luo

2018

Applied Surface Science

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“…Three typical single-point diamond scratchings consist of instrumented nanoscratching [65], atomic force microscopy [66], and precision motion stage scratching [67]. However, the common characteristic of three scratchings is the speed at micrometer per second, which is 6 to 8 orders of magnitude lower than those of grinding.…”

Section: Understanding the Residual Stresses Formation Based On Singlmentioning

confidence: 97%

“…The residual stress and its distribution in the ground surface/ subsurface layer are generally influenced by the following Int J Adv Manuf Technol factors: grinding wheel characteristics (i.e., abrasive type and distribution, porosity), dressing techniques, grinding parameters, cooling conditions, and workpiece material properties [31,58,[61][62][63][64][65][66][67][68][69][70][71][72][73][74][75][76][77].…”

Section: Influential Factors On Grinding-induced Residual Stressesmentioning

confidence: 99%

Review on grinding-induced residual stresses in metallic materials

Ding

Zhang

et al. 2016

Int J Adv Manuf Technol

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107

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This paper provides a state-of-the-art review on the investigations into the residual stresses in metallic structural materials generated by grinding. The materials covered include steels, titanium alloys, and nickel-based superalloys. The formation mechanisms of the residual stresses and their impacts are specifically discussed. Some major influential factors on the residual stresses formation in grinding, such as grinding wheel characteristics, dressing techniques, grinding parameters, cooling conditions, and properties of workpiece materials, are analyzed in detail. These include experimental measurement, modeling, simulation, knowledge-based monitoring, and fuzzy analysis. Finally, the paper highlights some important aspects of grinding-induced residual stresses for further investigation.

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“…Using the indentation test of silicon, Yoshino et al [10,11] demonstrated this case by finite element method (FEM) and experimental work during the machining process. Recently, Tang and Zhang [12] studied the nanoscratching induced nanocracking in the subsurface of monocrystalline silicon at ambient temperature. Chrobak et al [13] found that the plasticity of silicon determined by dislocations or by transformations between phases depends on the shape and dimension of silicon, and reported that the plasticity of bulk silicon dominates by phase transformations, whereas that of silicon nanoparticles display dislocation-driven.…”

Section: Introductionmentioning

confidence: 99%