2015
DOI: 10.1016/j.egypro.2015.03.282
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Summary of the 5th Workshop on Metallization for Crystalline Silicon Solar Cells

Abstract: The 5 th Metallization Workshop took place in Constance, Germany on 20 and 21 October 2014 and provided an overview of research and development in the field of solar cell metallization. Enhanced understanding of contact structure and formation was obtained thanks to new characterization techniques. Great progress in metallization technologies was also reported. Screen printing technology is continuing its trajectory of continuous improvement, notably with fine-line screen printing (linewidth < 50 μm) becoming … Show more

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Cited by 15 publications
(7 citation statements)
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“…Screen printing has become a standard and mature technology for phosphorous-doped junctions, and the mechanism of current conduction has been thoroughly investigated [8]. On other hand, on boron-doped junctions, screen printing can still present contact resistance and spiking limitations [9]. In addition, excellent results have been achieved with more advanced nickel/copper (Ni/Cu) contacts on n + surfaces [6], [10]- [14] and several toolsets are becoming commercially available [15], although high potential has been demonstrated also on p + silicon [16].…”
Section: Front Versus Rear Emitter Configurationmentioning
confidence: 99%
“…Screen printing has become a standard and mature technology for phosphorous-doped junctions, and the mechanism of current conduction has been thoroughly investigated [8]. On other hand, on boron-doped junctions, screen printing can still present contact resistance and spiking limitations [9]. In addition, excellent results have been achieved with more advanced nickel/copper (Ni/Cu) contacts on n + surfaces [6], [10]- [14] and several toolsets are becoming commercially available [15], although high potential has been demonstrated also on p + silicon [16].…”
Section: Front Versus Rear Emitter Configurationmentioning
confidence: 99%
“…In recent years, novel metallization schemes have been proposed to increase cell efficiencies and reduce cost [53]. Due to price pressures in cell manufacturing, there is a growing interest in the ability to replace silver metallization with a copper based alternative [54,55].…”
Section: Emerging Technologiesmentioning
confidence: 99%
“…In silicon technology, a metallic grid is deposited on the cell surface , commonly by screen printing of a silver paste. Such a technique requires high‐temperature treatments and relies on a relatively expensive material.…”
Section: Introductionmentioning
confidence: 99%