Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

State-of-the-Art in Chiplets Horizontal Communications

“…During IEEE/ECTC 2021 and 2022, IBM presented seven papers on "Direct Bonded Heterogeneous Integration (DBHi) Si Bridge" [10][11][12][13][14][15][16] (Fig. 9).…”

“…In Horbe et al and Chowehury et al [15,16], a detailed study on the TCB with NCP has been given. Fig.…”