Optical
far-field detection and imaging of deep-subwavelength objects
in a large-area wafer is challenging because of the well-known diffraction
barrier and weak Rayleigh scattering. Although the scattering signal
of deep subwavelength defects can be enhanced by various methods,
such as using a high full-well-capacity camera and increasing the
exposure time, the accurate classification of various defects and
the precise positioning of defects in a subwavelength domain is rather
challenging. In this letter, we report a theoretical framework that
the optical bright-field imaging microscopy, coupled with an optical
proximity correction-based structured light-field illumination mode,
could pinpoint and classify various sub-λ/14 wide defects in
a subwavelength domain in a large-area wafer. The underlying physics
is that the illuminated structured light field, which is customized
to mimic the geometrical feature of the background pattern in the
wafer, creates the defect-induced breakdown of geometrical and electromagnetic
symmetry. We believe that this work not only paves the route for optical
wafer defect inspection and classification at advanced technology
nodes but also could potentially be extended to many other areas,
such as biosensing, lithographic mask inspection, material characterization,
and nanoscale metrology.