Recent advances in unconventional foldable and stretchable electronics have forged a new field in electronics. However, traditional conducting metal oxides and metal thin films are inappropriate as electrodes for stretchable devices because they are vulnerable to tensile strain as well as bending strain. In this study, we describe the fabrication of annealing-free, copper nanowire (CuNW)-based stretchable electrodes using an inexpensive metal source through a simple and scalable process at low temperature without a vacuum. We also introduce a reversible and extremely stretchable (up to 700% of strain) helical, CuNW-based conducting spring, which has not been previously used for stretchable electrodes. NPG Asia Materials (2014) 6, e132; doi:10.1038/am.2014.88; published online 26 September 2014 INTRODUCTION Recent advances in unconventional foldable and stretchable electronics show great potential for future wearable applications, including smart skins, electronic eye-type imagers, skin-like pressure sensors, electronic textiles and muscle-like soft actuators. 1-5 Most of these applications require sufficient elasticity for bending, stretching, twisting and deformation into complex, non-planar shapes while maintaining good electrical properties and reliability. Stretchability is the most crucial property for the development of next-generation wearable devices. To date, two primary strategies have been suggested for the fabrication of stretchable electronic parts apart from complex lithography-based approaches that can shape inorganic conductive materials or metals into buckled geometries, including island-bridge systems. [6][7][8][9] The first strategy is the inclusion of micro-or nano-scale conductive carbon materials into elastic polymer matrices. 1,10-13 For example, carbon-based materials, such as carbon nanotubes and graphene, have been extensively researched for stretchable/foldable conductors. Ma et al. 13 fabricated helical ribbon-structured composites composed of carbon nanotubes and Ag flakes using a shape-memory polymer, demonstrating stable resistivity up to a strain of 600%. However, the application of these materials in large-area, integrated devices may be restricted by their relatively poor electrical properties and their high cost. The second strategy is to use highly conductive metallic nanostructures, such as rectangular-patterned gold nanosheets 14 (strain (ε) = 100% on Ecoflex substrate) or silver nanoparticles embedded in composite materials 15 (ε = 140% on elastomeric rubber fiber).Recently, networks of one-dimensional metal nanowires, accompanied by a simple, scalable process (for example, solution-phase