2023
DOI: 10.1039/d3qm00090g
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Super-strong reusable hot melt adhesives prepared from hyperbranched epoxy resin

et al.

Abstract: Hot melt adhesives have been broadly applied in vehicles, electronics, and packaging industries due to their excellent properties of no-pollution, easy-peeling, and little damage to the substrate surface. However, the...

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Cited by 6 publications
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“…Stimuli-responsive adhesives that can controllably debond and rebond have gained rapidly growing interest owing to their great potentials in biomedical engineering, microelectronics, and manufacturing industries. Recently, various types of stimuli-responsive adhesives that respond to different stimuli, such as temperature, light, electricity, and chemicals, have been developed. For example, hot melt adhesives can be easily debonded by heating substrates to their melting temperature, meaning that sufficient thermal conductivity and stability are required for substrates. Besides, light and electrical stimulus can be applied to debond adhesives when substrates have good transparency and conductivity, respectively. However, we notice that some kinds of substrates such as plastics are sensitive to high temperature and organic solvents and inert to stimuli like light and electricity, making them not applicable to conventional stimuli-responsive adhesives. Therefore, developing new types of stimuli-responsive adhesives that can stably adhere to thermolabile plastic substrates is of great significance.…”
mentioning
confidence: 99%
“…Stimuli-responsive adhesives that can controllably debond and rebond have gained rapidly growing interest owing to their great potentials in biomedical engineering, microelectronics, and manufacturing industries. Recently, various types of stimuli-responsive adhesives that respond to different stimuli, such as temperature, light, electricity, and chemicals, have been developed. For example, hot melt adhesives can be easily debonded by heating substrates to their melting temperature, meaning that sufficient thermal conductivity and stability are required for substrates. Besides, light and electrical stimulus can be applied to debond adhesives when substrates have good transparency and conductivity, respectively. However, we notice that some kinds of substrates such as plastics are sensitive to high temperature and organic solvents and inert to stimuli like light and electricity, making them not applicable to conventional stimuli-responsive adhesives. Therefore, developing new types of stimuli-responsive adhesives that can stably adhere to thermolabile plastic substrates is of great significance.…”
mentioning
confidence: 99%