“…In the context of group IV elemental and compound semiconductor processing, pulsed-LA applications are ubiquitous. ,, These include the fabrication of poly-Si thin-film transistors, − ultrashallow device junctions, ,− efficient contacts by silicidation, explosive crystallization, − strain, defect, , and dopant engineering. − Localized heating minimizes the risk of damaging sequentially integrated components of monolithic three-dimensional (3D) devices. − In optoelectronics, pulsed-LA is a key process for fabricating poly-Si displays, − thin metal-oxides, pure-carbon electrodes for touch screens or solar cells, and hyper-doped semiconductors for near-infrared photodetectors . It also allows strain, composition and morphology engineering of fiber-based photonic devices, and fabrication of heavily doped superconducting silicon for monolithic quantum device integration. ,− Despite all of these applications, understanding the ultrafast nonequilibrium kinetics of the liquid/solid interface in early stages of the process and correlating it to the postirradiation morphology and properties is challenging. This is because any experimental characterization, no matter how accurate, can only access the final state of the system.…”