2003
DOI: 10.1016/s0921-4534(02)02249-9
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Superconductive joint on Bi2223/Ag multifilamentary tape

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Cited by 6 publications
(4 citation statements)
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“…Kim et al [80] used the monofilament tape as the intermediate material. Wang et al [81] sandwiched the Bi-2223 precursor powder between the exposed filaments of two tapes. A new polycrystalline Bi-2223 layer was synthesized between the tapes by heat treatment, thereby achieving the superconducting joint.…”
Section: History Of the Development Of Superconducting Joint Between ...mentioning
confidence: 99%
See 1 more Smart Citation
“…Kim et al [80] used the monofilament tape as the intermediate material. Wang et al [81] sandwiched the Bi-2223 precursor powder between the exposed filaments of two tapes. A new polycrystalline Bi-2223 layer was synthesized between the tapes by heat treatment, thereby achieving the superconducting joint.…”
Section: History Of the Development Of Superconducting Joint Between ...mentioning
confidence: 99%
“…In 2009-2010, Guo et al [82,83] demonstrated superconducting joints between commercially available 4.3 mm wide and 0.22 mm thick tapes Bi-2223/Ag tapes with 61 filaments developed by Beijing Innova Superconductor Technology Co., Ltd The Ag sheath of the tapes was chemically etched using NH 3 /H 2 O 2 (aq). The exposed filaments were directly faced or indirectly overlapped by sandwiching Bi-2223 precursor powder as specified in [81]. To connect the filaments, heat treatment was performed at 800 • C for 2 h with uniaxial pressure of 3 MPa.…”
Section: History Of the Development Of Superconducting Joint Between ...mentioning
confidence: 99%
“…Literatures have reported [11] that the joint with precursor powder interlayer was fabricated by Tkaczyk' method (cold pressure under about 1000 MPa and post-annealing treatment at about 835°C for about 50 h). Note that the precursor powder was mainly composed of Bi-2212 phase (Bi 2 Sr 2 Ca 1 Cu 2 O d ) and a small amount of Ca 2 PbO 4 , CuO, Bi-2201, etc.…”
Section: Introductionmentioning
confidence: 99%
“…As for BSCCO superconductors, great effort has been made on the bonding technologies, such as melting welding, semi-solid bonding, resistive soldering, microwave bonding and the conventional diffusion bonding with or without interlayers which includes first high pressure cold-weld at room temperature and then annealing for 50∼200 hours at high temperature. [4][5][6][7][8][9] Compared with the above bonding technologies, the direct diffusion bonding with an uniaxial pressure to the bonding region during bonding thermal-cycle would be a promising * Author to whom correspondence should be addressed. one for fabricating high quality superconducting joints, leading to a high joining efficiency because of a shorted bonding period.…”
Section: Introductionmentioning
confidence: 99%