Superfinishing with Abrasive Films Featuring Discontinuous Surfaces

Abstract

This study introduces innovative designs for abrasive tools aimed at enhancing surface finishing processes. Prototypes consisting of non-continuous abrasive films with discontinuous surface carriers and abrasive layers were developed to improve the efficiency and effectiveness of the smoothing process. Four distinct abrasive films with varying nominal grain sizes were fabricated to explore the versatility and efficacy of the prototypes. The results indicate that the incorporation of carrier irregularities significantly influences surface finishing processes, leading to improvements in material removal efficiency and surface quality. Longitudinal discontinuities facilitate faster removal of irregularities from workpiece materials, reducing the risk of deep scratches on surfaces. Additionally, this study highlights the importance of tool motion patterns in optimizing material removal processes and ensuring surface quality. The integration of carrier irregularities with additional oscillatory tool motion shows promise for further improving surface quality. These findings advance our understanding of abrasive machining processes and provide valuable insights for optimizing abrasive tool designs and machining strategies for enhanced surface finishing.

Evaluation of the Surface Topography of Microfinishing Abrasive Films in Relation to Their Machining Capability of Nimonic 80A Superalloy

“…Based on the fact that abrasive grains are randomly distributed on the abrasive film, and at certain points, several grains may form abrasive aggregates, such a research range was chosen for cognitive purposes. Since it is assumed that abrasive grains below the level of 0.35 Sz measured from the highest peak of the entire surface no longer actively participate in the machining process, these spaces serve as storage for machining products, including chips from the workpiece material [41]. The value of hmax is determined by multiplying the coefficient k by Sz.…”

“…Based on the fact that abrasive grains are ran domly distributed on the abrasive film, and at certain points, several grains may form abrasive aggregates, such a research range was chosen for cognitive purposes. Since it assumed that abrasive grains below the level of 0.35 Sz measured from the highest pea of the entire surface no longer actively participate in the machining process, these space serve as storage for machining products, including chips from the workpiece material [41 The trimmed peaks from the surface of the abrasive film were analyzed for all thre abrasive films and at all cutoff levels. On each surface after trimming, the peaks were sub jected to analysis, with the number determined as n, and each peak was examined to d termine its highest point, allowing the height of the peak hi to be determined, where i 1…n.…”