Superior decoupling capacitor for three-dimensional LSI with ultrawide communication bus

Abstract

The superior noise reduction performance of an in-stack decoupling capacitor (DECAP) is demonstrated. A three-tier stacked demonstrator is manufactured with an ultrawide data bus that connects a top memory chip and a bottom logic chip. An in-stack evaluation circuitry on a middle tier (Si interposer) captures voltage variation waveforms during chip-to-chip data communication. In-stack DECAPs in arrays on a Si interposer and discrete ceramic capacitors on an organic interposer of a ball-grid array package are compared. Silicon measurements with an in-stack noise monitoring technique show that the DECAPs on the Si interposer more locally shunt out the AC components of power supply current over a wider frequency range than the capacitors on the package interposer.

Recent developments in the synthesis of chemically modified nanomaterials for use in dielectric and electronics applications

“…Thus reactions (2)-( 5) can self-propagate. Equation (6) shows the overall reaction of hydroxylation of nanomaterial surface. Choudhury [125] performed dielectric measurements of polyetherimide (PEI)/hydroxyl-functionalized BaTiO 3 nanocomposite films that were prepared by thermal imidization of the cast sample.…”

“…Consumer electronic devices [1,2], smart and wearable electronics [3,4], aerospace parts [5], telecommunications equipment [6,7], the military industry [8], and the automobile industry [9,10] require high-performance capacitors and other energy-storage devices. To meet the demand for capacitors in the above applications, capacitors based on ceramic materials have attracted increasing attention [11,12].…”

Effects of the Particle Size of BaTiO3 Fillers on Fabrication and Dielectric Properties of BaTiO3/Polymer/Al Films for Capacitor Energy-Storage Application

“…Capacitors with high energy and power densities are more and more indispensable in the present electronic information age [1]. Consumer electronic devices [2,3], smart and wearable electronics [4,5], aerospace industry [6], telecommunications equipment [7,8], the military industry [9] and the automobile industry [10,11], require high-performance capacitors and other energy-storage devices. To meet the demand for capacitors in the above applications, many capacitors with different types have been developed in recent years, including electrochemical capacitors (ECs) and dielectric capacitors.…”

Analysis and evaluation of noise coupling between through-silicon-vias

“…Through-silicon-vias (TSVs), the biggest feature of 3D-SICs, enable vertical signal transfer among stacked ICs which enhances performance and energy by optimized signal lines between stacked ICs [8][9][10][11][12][13]. Although wider signal bus is required for enormous scale data transfer, densely manufactured signal bus needs to solve crosstalk among the channels [14][15][16][17][18][19][20] as well as power line noise [21][22][23][24][25][26][27]. To avoid bit error caused by such crosstalk, it requires frequency or voltage optimization that cause additional issues like lower data transfer speed or larger power consumption, respectively [28,29].…”