2023
DOI: 10.1021/acs.energyfuels.2c03813
|View full text |Cite
|
Sign up to set email alerts
|

Superior Phosphorous Doping in Nanocrystalline Silicon Thin Films and Their Application as Emitter Layers in Silicon Heterojunction Solar Cells

Abstract: Phosphorous doping in the nc-Si network induces gradually reduced crystallinity; however, preferential growth along <220>-oriented crystallites promotes the columnar-like growth morphology. At optimum doping, substitution by donor P+-atoms in the c-Si lattice contributes surplus free electrons and high carrier mobility, resulting in superior electrical conductivity in the n-nc-Si network. An elevated doping leads to incorporating elemental P0 atoms in the interstitial position or forming P–Si–H clusters and ge… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
7
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
5

Relationship

2
3

Authors

Journals

citations
Cited by 5 publications
(7 citation statements)
references
References 86 publications
(155 reference statements)
0
7
0
Order By: Relevance
“…Later, four additional HJSCs (HJSC7–10) were developed in p / i / n core/shell geometry, where the intrinsic Si ( i -Si) shell coating was introduced in between its earlier p -shell layer and the n -core of the p / n configuration, following suitable materials characteristics as optimized for solar cells in a few prior publications of this laboratory (growth conditions for both p - and i -shells are listed in Table ). …”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Later, four additional HJSCs (HJSC7–10) were developed in p / i / n core/shell geometry, where the intrinsic Si ( i -Si) shell coating was introduced in between its earlier p -shell layer and the n -core of the p / n configuration, following suitable materials characteristics as optimized for solar cells in a few prior publications of this laboratory (growth conditions for both p - and i -shells are listed in Table ). …”
Section: Resultsmentioning
confidence: 99%
“…The cleaned SiNW arrays were utilized in the fabrication of p / n and p / i / n HJSCs in the core/shell configuration. The specific shell layers of HJSCs were developed following growth conditions optimized in our numerous earlier publications concerning the fabrication of solar cells, as listed in Table in Section of the present article. The plasma exposed area of the SiNW array samples during shell deposition was restricted to (1.5 × 1.5) cm 2 using steel masks attached to the substrate holder. For better charge collection during the functioning of the solar cells, a thin Sn-doped In 2 O 3 (ITO) film of thickness ∼80 nm and area ∼(1 × 1) cm 2 was grown on top of the p -layer by sputtering from an ITO target.…”
Section: Methodsmentioning
confidence: 99%
“…The freshly prepared chemically etched n -type c-Si-NWs samples were immediately transferred into an RF-PECVD chamber, where the NW surface was cleaned by a rapid in situ H 2 plasma treatment for 3 min. The different layers of the proposed Si-NW HJSCs were grown based on detailed characterization of the material done in our several previous publications and its use in the fabrication of solar cells. The growth conditions are listed in Table .…”
Section: Methodsmentioning
confidence: 99%
“… 9 However a-Si:H has been widely used in heterojunction (HIT) solar cells both as passivating and emitter layer and the use of n-doped μc/nc-Si:H has also shown excellent result as an emitter layer in HIT solar cells. 10 …”
Section: Introductionmentioning
confidence: 99%
“…Scientists have used different techniques to obtain good quality n type nc-Si:H films under controlled doping such as plasma enhanced chemical vapor deposition (PECVD), microwave PECVD, 12 electron beam evaporation, 13 electron cyclotron resonance PECVD, 14 Si ion implantation, 15 hot wire CVD, 16 cathodic vacuum arc, 17 RF magnetron sputtering 18 etc. Furthermore, in case of selection of wafer, n type possess lower defect density, low recombination rate of charge carriers at the interface and even high resistance against degradation 10 than p type wafer. But the major concern is high production cost of n type ingots and hence less availability in the market.…”
Section: Introductionmentioning
confidence: 99%