2010
DOI: 10.1002/app.32784
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Superiority of nanosized over microsized hyperbranched polymer second phase in modifying brittle epoxy resin

Abstract: A hydroxyl-functionalized hyperbranched polymer (HBP, H30) is used to modify 4,4 0 -diaminodiphenylsulfone-cured bisphenol-A type epoxy resin and a separate phase structure of modified epoxy resins is observed. The effects of the H30 second phase size on the mechanical properties of modified epoxy systems are investigated systematically. The dependence of the toughening mechanisms on the HBP particle size is reported for the first time. It is shown that the nanosized H30 second phase is superior over microsize… Show more

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Cited by 21 publications
(16 citation statements)
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References 42 publications
(97 reference statements)
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“…These trends could be attributed to two factors: on the one hand, the chemical incorporation of the HBPU into the epoxy networks would result in a higher crosslinking density which would lead to a shift in T g to higher temperature; on the other hand, the glass‐transition temperature of HBPU‐G3 is 3.7°C. Therefore, it was easy to understand that T g would be reduced by the introduction of HBPU with low glass‐transition temperature . So, these factors should result in appearance of maximum T g as the content of HBPU increased.…”
Section: Resultsmentioning
confidence: 99%
“…These trends could be attributed to two factors: on the one hand, the chemical incorporation of the HBPU into the epoxy networks would result in a higher crosslinking density which would lead to a shift in T g to higher temperature; on the other hand, the glass‐transition temperature of HBPU‐G3 is 3.7°C. Therefore, it was easy to understand that T g would be reduced by the introduction of HBPU with low glass‐transition temperature . So, these factors should result in appearance of maximum T g as the content of HBPU increased.…”
Section: Resultsmentioning
confidence: 99%
“…The crack length increases as the crack front extends by bowing, leading to a high line energy and enhancement of crack resistance . Energy is absorbed when a material is subjected to an external force; hence, crack pinning is a key toughening mechanism for CTBN‐modified epoxies.…”
Section: Resultsmentioning
confidence: 99%
“…At present, the resin used in rigid CCLs is basically epoxy resin. Due to the problem of high brittleness of the cured epoxy resin, the CCL prepared by the epoxy resin has a large brittleness, which is prone to cracking during the cutting and stamping process . This will adversely affect the processing of subsequent PCBs and the packaging of electronic components, and greatly reduce the product yield rate.…”
Section: Introductionmentioning
confidence: 99%