Supporting data for "Microscopic metallic air-bridge arrays for connecting quantum devices"

Jin, Yiqing; Moreno, María N.; Vianez, P. M. T.; Ford, C. J. B.

doi:10.17863/cam.66595

2021

DOI: 10.17863/cam.66595

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Supporting data for "Microscopic metallic air-bridge arrays for connecting quantum devices"

Yiqing Jin¹,

María N. Moreno²,

P. M. T. Vianez³

et al.

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Microscopic metallic air-bridge arrays for connecting quantum devices

Jin

Moreno

Vianez

et al. 2021

Applied Physics Letters

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We present a single-exposure fabrication technique for a very large array of microscopic air-bridges using a tri-layer resist process with electron-beam lithography. The technique is capable of forming air-bridges with strong metal-metal or metal-substrate connections. This was demonstrated by its application in an electron tunneling device consisting of 400 identical surface gates for defining quantum wires, where the air-bridges are used as suspended connections for the surface gates. This technique enables us to create a large array of uniform one-dimensional channels that are open at both ends. In this article, we outline the details of the fabrication process, together with a study and the solution of the challenges present in the development of the technique, which includes the use of water-IPA (isopropyl alcohol) developer, calibration of the resist thickness, and numerical simulation of the development.

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Microscopic metallic air-bridge arrays for connecting quantum devices

Jin

Moreno

Vianez

et al. 2021

Applied Physics Letters

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show abstract

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Supporting data for "Microscopic metallic air-bridge arrays for connecting quantum devices"

Cited by 1 publication

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Microscopic metallic air-bridge arrays for connecting quantum devices

Microscopic metallic air-bridge arrays for connecting quantum devices

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