2017
DOI: 10.1016/j.proeng.2017.04.049
|View full text |Cite
|
Sign up to set email alerts
|

Supporting Lightweight Design: Virtual Modeling of Hot Stamping with Tailored Properties and Warm and Hot Formed Aluminium

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
7
0
1

Year Published

2017
2017
2023
2023

Publication Types

Select...
6
1
1

Relationship

0
8

Authors

Journals

citations
Cited by 11 publications
(9 citation statements)
references
References 2 publications
0
7
0
1
Order By: Relevance
“…The interfacial heat transfer coefficient at a contact pressure of 20 MPa was investigated in the literature. Then, the study of Bosetti et al suggested about 2 kW/m 2 K [35], the study of Vrolijk et al suggested about 2.8 kW/m 2 K [33], and the study of Liu et al suggested about 9 kW/m 2 K [36]. Therefore, from the average of the above three values, the interfacial heat transfer coefficient at a contact pressure of 20 MPa could be estimated as 4.6 kW/m 2 K. Based on this, the interfacial heat transfer coefficient expressed as a function of contact pressure as shown in Figure 8 was applied to this analysis.…”
Section: Effect Of Process and Materials Variables On Hot Stamping Fo...mentioning
confidence: 98%
See 2 more Smart Citations
“…The interfacial heat transfer coefficient at a contact pressure of 20 MPa was investigated in the literature. Then, the study of Bosetti et al suggested about 2 kW/m 2 K [35], the study of Vrolijk et al suggested about 2.8 kW/m 2 K [33], and the study of Liu et al suggested about 9 kW/m 2 K [36]. Therefore, from the average of the above three values, the interfacial heat transfer coefficient at a contact pressure of 20 MPa could be estimated as 4.6 kW/m 2 K. Based on this, the interfacial heat transfer coefficient expressed as a function of contact pressure as shown in Figure 8 was applied to this analysis.…”
Section: Effect Of Process and Materials Variables On Hot Stamping Fo...mentioning
confidence: 98%
“…A forming analysis using PAM-STAMP 2015.01 was performed to obtain the formability sensitivity. It is known that PAM-STAMP can provide reliable forming analysis results for various stamping processes including hot stamping processes [32,33]. In simulations using the explicit dynamic finite element code PAM-STAMP, the die was modeled as a rigid body and the sheet blank was modeled as an elastic-plastic shell element.…”
Section: Effect Of Process and Materials Variables On Hot Stamping Fo...mentioning
confidence: 99%
See 1 more Smart Citation
“…However, the components with high strength and low levels of ductility did not show a good performance in crash energy absorption [3,4]. To improve the energy absorption, tailored hot stamping (THS) components with tailored mechanical properties have been developed [5][6][7][8]. From continuous cooling transformation (CCT) curve, it can be seen that ferrite and bainite can be obtained at cooling rates lower than 30 • C/s [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…The analysis of the phenomena occurring during sheet metal stamping is described in publication [4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%