Suppressed Cracking in Drying Nanoparticle-Polymer Coatings at High Peclet Numbers

Yamamura, Masato; Ono, Hiromi; Uchinomiya, Tetsuro; Mawatari, Yoshihide; Kage, Hiroyuki

doi:10.1252/jcej.08we295

Cited by 7 publications

(3 citation statements)

References 10 publications

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“…Instead, the crack formation may be generated by the nucleation of new cracks, for which the crack spacing does not only depend on lm thickness, but also on drying rate and initial defect concentration. [47][48][49][50] This quantitative deviation between the data and the results predicted by eqn (2) indicates that the elastic fracturing model is too simplistic to adequately capture the behavior of the (organo)silica thin lms in a broad range of regimes. Thus, a new, unied theory is required to explain these different data for diverse systems.…”

Section: Crack Spacingmentioning

confidence: 90%

Formation and prevention of fractures in sol–gel-derived thin films

et al. 2015

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Sol-gel-derived thin films play an important role as the functional coatings for various applications that require crack-free films to fully function. However, the fast drying process of a standard sol-gel coating often induces mechanical stresses, which may fracture the thin films. An experimental study on the crack formation in sol-gel-derived silica and organosilica ultrathin (submicron) films is presented. The relationships among the crack density, inter-crack spacing, and film thickness were investigated by combining direct micrograph analysis with spectroscopic ellipsometry. It is found that silica thin films are more prone to fracturing than organosilica films and have a critical film thickness of 300 nm, above which the film fractures. In contrast, the organosilica films can be formed without cracks in the experimentally explored regime of film thickness up to at least 1250 nm. These results confirm that ultrathin organosilica coatings are a robust silica substitute for a wide range of applications.

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Section: Crack Spacingmentioning

confidence: 90%

Formation and prevention of fractures in sol–gel-derived thin films

et al. 2015

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“…Experiments conducted by Yamamura et al gives us a reference that paste with high Peclet number is less likely to have brittle crack. 26 In conclusion, the nano-paste shows high sinter activity but suffers from crack formation during drying at low temperature, while the micro-paste shows sufficient drying but they form only a low number of unstable sintering necks. Therefore, trading off between the paste packing density and particle size, which is in turn dependent on the mixture ratio, it becomes vital to get a paste with no-cracks and displaying an enhanced mechanical stability.…”

mentioning

confidence: 86%

Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Dai

Anantha

et al. 2016

Applied Physics Letters

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An enhanced copper paste, formulated by copper micro-and nano-particles mixture, is reported to prevent paste cracking and obtain an improved packing density. The particle mixture of two different sizes enables reduction in porosity of the micro-paste and resolves the cracking issue in the nanopaste. In-situ temperature and resistance measurements indicate that the mixed paste has a lower densification temperature. Electrical study also shows a $12Â lower sheet resistance of 0.27 X/sq. In addition, scanning electron microscope image analysis confirms a $50% lower porosity, which is consistent with the thermal and electrical results. The 3:1 (micro:nano, wt. %) mixed paste is found to have the strongest synergistic effect. This phenomenon is discussed further. Consequently, the mixed paste is a promising material for potential low temperature 3D interconnects fabrication.

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“…Numerous studies have been reported on crack‐morphology control via air blowing, 35 electrostatic interactions among dispersing solids, 36 the hydrophilic/hydrophobic surface patterning of the substrate, 37,38 the addition of soft particles that deform to shrink pores between particles, 39‐41 constrained geometry, 42 and evaporation on elastomeric or liquid substrates on which the film shrinkage is no longer hampered by the adhesion on the substrate 28,43 . However, it is not clearly evident how the adsorbing/nonadsorbing nature of polymeric additives on particle surfaces resist crack propagation.…”

Section: Introductionmentioning

confidence: 99%

Adsorption‐mediated nonlinearity of critical cracking thickness in drying nanoparticle–polymer suspensions

Yamamura

2021

AIChE Journal

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We examine the critical cracking thicknesses of as‐dried colloidal TiO2 suspensions containing water‐soluble polymeric additives, above which cracks spontaneously propagate. In contrast to common observations, the critical cracking thickness increases in a nonlinear, stepwise manner as increasing the concentration of the polymeric additive in the suspension. The critical thickness diverges when the polymer content increases above a certain threshold. We demonstrate that the first and second critical cracking thickness increments are attributable to the onset of polymer adsorption and a subsequent transition in the conformations of the adsorbing polymer chains, respectively. The critical thickness profiles with respect to normalized polymer adsorption amounts at different particle diameters converged into a single master curve. These results illustrate nontrivial evaporation processes in which the various roles of polymeric additives delay cracking into thicker films.

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Suppressed Cracking in Drying Nanoparticle-Polymer Coatings at High Peclet Numbers

Cited by 7 publications

References 10 publications

Formation and prevention of fractures in sol–gel-derived thin films

Formation and prevention of fractures in sol–gel-derived thin films

Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Adsorption‐mediated nonlinearity of critical cracking thickness in drying nanoparticle–polymer suspensions

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