Suppression of grain boundary steps in chemical mechanical polishing of W-Ni-Fe alloy by a citric acid-based slurry

Guo, Jun; Song, Chuanping; Niu, Lin; Shi, Xu; Jin, Zhuji; Guo, Changsheng; Namba, Yoshiharu

doi:10.1016/j.mfglet.2020.07.004

Cited by 6 publications

(4 citation statements)

References 16 publications

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“…Acid slurries, instead, have been shown to reduce roughness while polishing tungsten alloy. For example, citric acid-based slurry balances mechanical and chemical processes and prevents grain boundary steps from developing, thus offering a superior surface finish [ 76 ]. Li et al [ 74 ] used acid colloidal silica to obtain sub-nanometer roughness for YAG crystal, showing that the acidic slurry facilitates chemical reactions and the elimination of surface scratches or damages.…”

Section: Chemical Modification Polishing Approachesmentioning

confidence: 99%

Polishing Approaches at Atomic and Close-to-Atomic Scale

2023

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Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes. This review presents polishing approaches at atomic and close-to-atomic scale on planar and curved surfaces, including chemical mechanical polishing, plasma-assisted polishing, catalyst-referred etching, bonnet polishing, elastic emission machining, ion beam figuring, magnetorheological finishing, and fluid jet polishing. These polishing approaches are discussed in detail in terms of removal mechanisms, polishing systems, and industrial applications. The authors also offer perspectives for future studies to address existing and potential challenges and promote technological progress.

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Section: Chemical Modification Polishing Approachesmentioning

confidence: 99%

Polishing Approaches at Atomic and Close-to-Atomic Scale

2023

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“…Currently, research on WHA machining is limited and mainly focuses on areas such as the ultrasonic elliptical vibration cutting and leveraging of single-crystal diamond tools [ 8 , 9 , 10 ], tool wear mechanisms [ 11 , 12 , 13 , 14 ], and chemical–mechanical polishing [ 15 , 16 ]. Yin et al [ 8 ] proposed a design for a single-excitation-based ultrasonic elliptical vibration cutting device.…”

Section: Introductionmentioning

confidence: 99%

Optimization of Tungsten Heavy Alloy Cutting Parameters Based on RSM and Reinforcement Dung Beetle Algorithm

Zhu

Chen

et al. 2023

Sensors

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Tungsten heavy alloys (WHAs) are an extremely hard-to-machine material extensively used in demanding applications such as missile liners, aerospace, and optical molds. However, the machining of WHAs remains a challenging task as a result of their high density and elastic stiffness which lead to the deterioration of the machined surface roughness. This paper proposes a brand-new multi-objective dung beetle algorithm. It does not take the cutting parameters (i.e., cutting speed, feed rate, and depth of cut) as the optimization objects but directly optimizes cutting forces and vibration signals monitored using a multi-sensor (i.e., dynamometer and accelerometer). The cutting parameters in the WHA turning process are analyzed through the use of the response surface method (RSM) and the improved dung beetle optimization algorithm. Experimental verification shows that the algorithm has better convergence speed and optimization ability compared with similar algorithms. The optimized forces and vibration are reduced by 9.7% and 46.47%, respectively, and the surface roughness Ra of the machined surface is reduced by 18.2%. The proposed modeling and optimization algorithms are anticipated to be powerful to provide the basis for the parameter optimization in the cutting of WHAs.

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“…Therefore, it is widely used in civil and military industries [ 1 ]. At present, tungsten alloy machining methods mainly include cutting [ 2 ], grinding and polishing [ 3 ]. In the traditional cutting process, due to the large differences between the characteristics of biphase materials in tungsten alloy, the workpiece appears with scaly spines and furrows, and a series of problems such as tool wear, poor machining integrity and chip adhesion occur, which makes it difficult to obtain the high surface quality of tungsten alloy, and limits the application of tungsten alloy [ 4 ].…”

Section: Introductionmentioning

confidence: 99%

“…In the meantime, the ultrasonic grinding process could not only reduce the grinding force and grinding temperature, but also reduce the wear area of diamond. Shi et al [ 3 ] carried out an experimental study on the grinding and polishing of tungsten alloy and silicon carbide sandpaper, with a particle size of 38 μm, 25 μm, 18 μm and 15 μm, and a diamond consolidation abrasive grinding pad with a particle size of 8 μm was used for grinding. It was found that the particle size was smaller and the ground surface was smoother; meanwhile, it was demonstrated that the height difference between the tungsten phase and the bonding phase was obvious on the surface of the polished tungsten alloy when using a silica sol polishing solution with an average particle size of 72 nm, in which the tungsten was higher and the bond was lower.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on Laser Ablation Texture-Assisted Grinding of Tungsten Alloy

Chen

et al. 2022

Materials

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In order to machine the tungsten alloy with high efficiency, low damage and precision, laser ablation texture technology and precision grinding technology were combined to carry out grinding experiments of tungsten alloy and laser ablation texture-assisted grinding experiments. The advantages of laser ablation texture-assisted grinding tungsten alloy were investigated by comparing of the surface morphology, grinding force and surface roughness between ordinary grinding and laser ablative texture-assisted grinding. The results demonstrate that the surface morphology of ordinary grinding tungsten alloy was poor, the surface roughness was relatively high and the grinding force was relatively large. The surface morphology of the laser ablation texture-assisted grinding tungsten alloy processed by laser ablation texture was improved, the surface roughness decreased by 0.023 µm–0.204 µm, the normal force decreased by 49.91–59.46% and the tangent force decreased by 44.11–58.49%. Meantime, for the area ratio of texture A being the most, the grinding effect was related to the area ratio of texture, and the lowest grinding force and the best surface quality were observed on the tungsten alloy with the laser ablated texture A; the grinding forces and roughness of the other textures’ workpiece was similar and close because of their similar area ratios. The results demonstrate that laser ablation texture-assisted grinding of tungsten alloy could improve machining quality and reduce grinding force, which would provide guidance for realizing the high efficiency and precision machining of tungsten alloy.

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Suppression of grain boundary steps in chemical mechanical polishing of W-Ni-Fe alloy by a citric acid-based slurry

Cited by 6 publications

References 16 publications

Polishing Approaches at Atomic and Close-to-Atomic Scale

Polishing Approaches at Atomic and Close-to-Atomic Scale

Optimization of Tungsten Heavy Alloy Cutting Parameters Based on RSM and Reinforcement Dung Beetle Algorithm

Experimental Study on Laser Ablation Texture-Assisted Grinding of Tungsten Alloy

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