Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Illés, Béla; Choi, Halim; Hurtony, Tamás; Dusek, Karel; Busek, David; Skwarek, Agata

doi:10.1016/j.jmrt.2022.08.172

Cited by 19 publications

(2 citation statements)

References 44 publications

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“…Excellent joints play a key role in ensuring the quality and reliability of welded parts [1,2]. With the speedy development of the electronics industry, there are increasing requirements for soldering and brazing technologies in the packaging of microelectronic devices [3,4].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Tong

Rong

Wang

2023

Metals

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In this study, the solidified microstructure and phase transition temperatures of Ag50.5Cu33.3Sn16.2-xInx (x = 5.0, 6.6, 8.2, 9.1, 9.9, 10.7, 11.5, 12.3; at.%) alloys were investigated using a scanning electron microscope with energy dispersive spectrometer (SEM-EDS) and differential thermal analysis (DTA). The experimental microstructure of Ag50.5Cu33.3Sn16.2-xInx alloys demonstrates that the phase fraction of Fcc(Ag) phase increased gradually as the addition of In increased, while the phase fraction of Fcc(Cu) phase decreased. Moreover, the liquidus temperatures of Ag50.5Cu33.3Sn16.2-xInx alloys also decrease with increasing In content. In this work, the Ag-Cu-Sn-In quaternary thermodynamic database was ideally extrapolated from the published literature for Ag-Cu-Sn, Ag-Cu-In, Ag-Sn-In and Cu-Sn-In thermodynamic databases. The calculated vertical section of Ag50.5Cu33.3Sn16.2-Ag50.5Cu33.3In16.2 agreed generally with the phase transition temperatures measured in the present experiment. Finally, the solidification behaviors of Ag50.5Cu33.3Sn16.2-xInx as-cast alloys were analyzed by thermodynamic calculation of the Scheil–Gulliver non-equilibrium model. The simulated solidification processes of some Ag50.5Cu33.3Sn16.2-xInx alloys are, in general, consistent with the experimental results in the present work, which would provide a theoretical basis for the design of novel Ag-Cu-Sn-In brazing alloys.

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Section: Introductionmentioning

confidence: 99%

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Tong

Rong

Wang

2023

Metals

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“…Even so, Sn-1 wt.% Ag-Cu low-Ag solder had a degradation in mechanical strength when compared to Sn-Ag-Cu eutectic solder. It was resolved through introducing some nano-scaled refractory materials (e.g., Graphene, nano-Al 2 O 3 , nano-ZnO, nano-TiO 2 ) into solder to share partial external stress, and finally hindering grain boundary motions to strengthen the alloy [25][26][27][28].…”

Section: Introductionmentioning

confidence: 99%

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

Huang²,

et al. 2022

Crystals

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Recently, 3D packaging has been regarded as an important technical means to continue Moore’s Law. However, excessive stacking will increase the longitudinal dimension, and one chip with high-density bondings packaging is still needed. Thus, it naturally places higher demand on thermal cycling reliability due to the decreased joint size to satisfy high-density packaging. In this work, the nano-Al2O3 (1 wt.%) modified Sn-1 wt.% Ag-0.5 wt.% Cu low-Ag solder was applied as a solder sample to evaluate the associated thermal cycling reliability. The investigated results revealed that the nano-Al2O3 modified solder did present enhanced thermal cycling reliability, as evidenced by the delayed microstructure coarsening and the inhibited atom inter-diffusion at interface caused by the adsorption of nano-Al2O3 on grain surfaces, and the resultant pinning effect. Worthy of note is that the potential of the newly developed nano-Al2O3 modified solder for high-density packaging applications (e.g., BGA, QFN, and CCGA) was evaluated based on the Finite Element Modeling.

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Insight into influence of temperature on electrochemical corrosion behavior of SAC305 tin-based solder alloy in NaCl solution

Liao,

Zhou,

Luo

et al. 2023

J Mater Sci: Mater Electron

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Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Cited by 19 publications

References 44 publications

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

Insight into influence of temperature on electrochemical corrosion behavior of SAC305 tin-based solder alloy in NaCl solution

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