2024
DOI: 10.1021/acsami.4c13501
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Supramolecular Luminescent Copper-Nanocluster-Based Dough with Excellent Electrical Conductivity Sensing Properties

Mengdi Sun,
Shulin Li,
Qingdong Wang
et al.

Abstract: In recent years, the rapid advancement of flexible conductive materials has significantly increased the demand for dough materials that offer high flexibility and conductivity for diverse applications. Here, we developed a flexible, stretchable, and self-healing dough utilizing hydrogen-bonding interactions between glutathione-stabilized copper nanoclusters (GSH-Cu NCs) and poly(acrylic acid) (PAA). The dough materials can be kneaded, readily reshaped, and further processed to create bulk materials of arbitrar… Show more

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