Surface analysis by work function measurements in a Scanning Auger Microprobe

Bachmann, Gerd; Scholtes, J.

doi:10.1007/bf00469136

Cited by 20 publications

(7 citation statements)

References 9 publications

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“…The work function changes were measured with the use of the socalled "onset method" [13]. In this method the low-energy part of the secondary electron energy distribution is used (Fig.…”

Section: Methodsmentioning

confidence: 99%

Very Thin Silver Layer Growth on the Cu(1II) Face at Different Temperatures

Mróz¹,

Stachnik²

1992

Acta Phys. Pol. A

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“…The work function changes were measured with the use of the socalled "onset method" [13]. In this method the low-energy part of the secondary electron energy distribution is used (Fig.…”

Section: Methodsmentioning

confidence: 99%

Very Thin Silver Layer Growth on the Cu(1II) Face at Different Temperatures

Mróz¹,

Stachnik²

1992

Acta Phys. Pol. A

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“…As another recent approach for high resolution work function measurements, a microprobe technique based on the so-called onset method has been developed in our own group [7,8]. As a particular advantage, this technique can be readily incorporated into existing scanning Auger microprobes, thus enabling combined Auger electron and work function studies with high lateral resolution [9,10].…”

Section: Introductionmentioning

confidence: 98%

Scanning work function microscopy

Oechsner

1996

Analytical and Bioanalytical Chemistry

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When a sample is locally excited with a highly focused raster-scanned beam of keV electrons, the variations DeltaPhi of the work function across the surface can be monitored from the shift of the onset energy for secondary electron emission along a fixed energy scale. The performance of that "onset" technique of work function microscopy and its incorporation into scanning Auger microprobes is described. The potentialities of this extremely surface sensitive technique for structural and chemical microanalysis are demonstrated by different experimental examples comprising work function analysis of surface reactions, and sputter depth profiling with in-situ Auger and work function spectroscopy. Scanning work function microscopy for surface microanalysis is shown to supply a lateral resolution down to the 10 nm range with a detection limit below 10(-2) of a monolayer.

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“…However, WFS can also be performed by the use of any other beam that will provide secondary electron emission. [17][18][19][20][21][22][23][24] Nowadays, these measurements are frequently realized using UV-light in order to provide absolute work function measurement, as it was initially proposed by Park and co-authors. 6 WFS is typically used to follow adsorption and deposition processes in real time.…”

Section: Introductionmentioning

confidence: 99%

“…Surface mapping of the work function can then be achieved in this kind of measurements with a lateral resolution comparable to that of the primary beam diameter. [17][18][19][20][21][22] Such experimental arrangement is known as Work Function Microscopy (WFM).…”

Section: Introductionmentioning

confidence: 99%

Influence of the patch field on work function measurements based on the secondary electron emission

Bundaleski

Trigueiro

Silva

et al. 2013

Journal of Applied Physics

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A work function study based on the onset shift (i.e., following low energy cutoff) of secondary electron spectra has been used for the last four decades to monitor the deposition and adsorption in real time, measure the dipole momentum and polarizability of the surface layer, and determine the lateral distribution of the work function. In this work, we show that the onset shift depends on both the coverage of adsorbed species that change the work function and the size of low work function patches. Additionally, the extraction field, which is always applied in these measurements, may also influence the onset shift. Numerical calculations of the potential distributions above different non-uniform surfaces were performed in order to quantitatively determine each of these influences. Depending on the patch size, we define three measurement regimes in which the onset position is related to either the surface average of the work function (small patches), the minimum local work function (large patches), or a value in-between (intermediate size patches). Experimental data have corroborated these findings and demonstrated that manipulating the extraction field intensity enables transition between the measurement regimes. Typical misinterpretations due to neglecting the patch size contribution and the surface non-uniformity to the onset shift are analyzed. Additionally, possible application of work function study for determination of the growth mode in the case of submonolayer deposition was discussed. V

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Surface analysis by work function measurements in a Scanning Auger Microprobe

Cited by 20 publications

References 9 publications

Very Thin Silver Layer Growth on the Cu(1II) Face at Different Temperatures

Very Thin Silver Layer Growth on the Cu(1II) Face at Different Temperatures

Scanning work function microscopy

Influence of the patch field on work function measurements based on the secondary electron emission

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