2023
DOI: 10.1002/sia.7237
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Surface analysis insight note: X‐ray photoelectron spectroscopy analysis of battery electrodes—Challenges with nickel–manganese–cobalt and Li examples using an Al Kα x‐ray source

Abstract: X‐ray photoelectron spectroscopy (XPS) has become a highly important tool for the analysis of battery materials and components. However, both anecdotal and detailed analysis of selected parts of the literature indicate that many reports of XPS on battery electrodes have significant analysis or data flaws. In this paper, we highlight several of the common challenges that analysts face when using XPS for battery materials, pointing to recent literature that addresses many of the critical issues associated with s… Show more

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Cited by 6 publications
(3 citation statements)
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“…X-ray photoelectron spectroscopy (XPS) provides in-depth insight into the elemental composition, chemical state, and electronic state of the elements present in a material [ 46 ]. From Figure 5 and Table 3 , a detailed understanding of the surface chemistry of the 5:1@120 AC sample can be extrapolated.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…X-ray photoelectron spectroscopy (XPS) provides in-depth insight into the elemental composition, chemical state, and electronic state of the elements present in a material [ 46 ]. From Figure 5 and Table 3 , a detailed understanding of the surface chemistry of the 5:1@120 AC sample can be extrapolated.…”
Section: Resultsmentioning
confidence: 99%
“…In essence, the increasing KOH ratio not only aids in diminishing defects but also promotes the formation of layered carbon structures, making the samples progressively more graphitic. X-ray photoelectron spectroscopy (XPS) provides in-depth insight into the elemental composition, chemical state, and electronic state of the elements present in a material [46]. From Figure 5 and Table 3, a detailed understanding of the surface chemistry of the 5:1@120 AC sample can be extrapolated.…”
Section: Spectroscopic Analysismentioning
confidence: 99%
“…Several sources of artifacts can result from beam damage during physical and chemical characterization. The use of Ar-ion and gas-cluster ion beams (GCIB) to perform depth profiling by X-ray photoemission spectroscopy (XPS), [6][7][8][9][10] time of flight secondary ions mass spectroscopy (ToF-SIMS), [11][12][13] or focused ion beam (FIB) [14][15][16] induces SEI chemical and morphological changes due to the preferential etching occurring during beam exposure. Exposure to the electron gun when using scanning electron microscopy (SEM) or transmission electron microscopy (TEM) [17][18][19] can also be a source of damage due to charging effects and local heating induced by electrical current density dispersed through the SEI.…”
mentioning
confidence: 99%