1979
DOI: 10.1016/0040-6090(79)90342-0
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Surface and grain boundary diffusion

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Cited by 6 publications
(1 citation statement)
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“…Assuming that  ~ (0.6-0.7)T M , (T M = bulk melting point) [37], one finds for the silica particles (with T M = 2000 K), that (Silica) ≂ 1200 K, while for the silicon substrate (with T M = 1683 K), that (Silicon) ≂ 1000 K, respectively. As mentioned in the Experimental section, the Ar + beam power density is several orders of magnitude lower than that was for Ga + ion irradiation, so that heating by the Ar + beam cannot reach the temperature of 2D melting.…”
mentioning
confidence: 99%
“…Assuming that  ~ (0.6-0.7)T M , (T M = bulk melting point) [37], one finds for the silica particles (with T M = 2000 K), that (Silica) ≂ 1200 K, while for the silicon substrate (with T M = 1683 K), that (Silicon) ≂ 1000 K, respectively. As mentioned in the Experimental section, the Ar + beam power density is several orders of magnitude lower than that was for Ga + ion irradiation, so that heating by the Ar + beam cannot reach the temperature of 2D melting.…”
mentioning
confidence: 99%