Surface Cleaning by Electrostatic Removal of Particles

Cooper, Douglas W.; Wolfe, H. L.; Yeh, James T.; Miller, Robert J.

doi:10.1080/02786829008959428

Cited by 35 publications

(8 citation statements)

References 12 publications

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“…Equations defining these adhesion forces are found in the references. [4][5] [7] Work was done to analyse the equations defining the various forces of adhesion and a list of all the variable compiled, firstly, to identify the parameters which dominated the strength of the forces and, secondly, to select the variables which could easily be altered within the contact cleaning process. This is especially important as the exact properties of the surfaces to be cleaned and the type of particles which are to be removed are not under the control of the cleaning process.…”

Section: Adhesion Forcesmentioning

confidence: 99%

55.4: Developments in Fast Cleaning of Thin Films without Wrapping

Hamilton

2019

Symp Digest of Tech Papers

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In the display industry cleanliness of the materials used to build up the display is vital to avoid defects and most major manufacturers use rubber roller contact cleaning systems to remove any particles of contamination. As the films used in displays and backlights get thinner, this type of cleaning equipment can result in process issues relating to the wrapping of the sheets of film around the contact roller due to a variety of adhesion forces. This paper reports the development work done on a new cleaning roller system to alter several of the factors affecting the adhesion forces between the roller and the film. The work reported includes • Developing a new formulation of cleaning rubber to minimise tribocharging of the film • Development of a new functional surface for the cleaning roller to modify the Van de Waals forces between the roller and the film • Minimising the static charge environment within the equipment This new cleaning system can process sheets of film down to 27.5 microns thick at speeds up to 20m/min without creasing, wrapping or scratching.

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Section: Adhesion Forcesmentioning

confidence: 99%

55.4: Developments in Fast Cleaning of Thin Films without Wrapping

Hamilton

2019

Symp Digest of Tech Papers

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“…From left to right, the wafer first passes the Tacky Roller (4). The roller is pushed against the wafer by a balancing weight (5). Then, the VUV lamp (6) is passed for photoelectric particle charging for enhanced removal by the high voltage electrode (7).…”

Section: Test-bench Design and Constructionmentioning

confidence: 99%

“…Removal takes place if the electric force dominates the adhesive forces, which are the Van der Waals force, the capillary force and the image charge force. Typical values of electric fields for removing 1μm particles are between 100 kV/cm and 1 MV/cm [5]. Besides, it may take considerable time to charge particles by the applied electric field.…”

Section: Introductionmentioning

confidence: 99%

Contamination control: removing small particles from increasingly large wafers

et al. 2012

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With the introduction of 450 mm wafers, which are considerably larger than the currently largest wafers of 300mm, handling with side grippers is no longer possible and backside grippers are required. Backside gripping increases the possible buildup of particles on the backside of the wafers with possible cross-contamination to the front-side. Therefore, regular backside cleaning is required. Three vacuum compatible cleaning methods were selected. Tacky rollers and highvoltage cleaning were selected for particles and plasma cleaning for molecular layers. A test-bench was designed and constructed implementing these three cleaning methods. The first experiments show promising results for the plasma cleaner and the tacky roller.

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“…Over the past 20 years, attention has been directed toward examining the impact of very small (micrometer-sized) particles with surfaces, where additional forces are present that contribute to particle adhesion. This problem is relevant to many contemporary applications, e.g., spacecraft particulate contamination (Fong et al, 1995) and microelectronics manufacturing (Cooper et al, 1990). The July 1995 special issue of Aerosol Science and Technology (vol.…”

Section: Introductionmentioning

confidence: 99%