Surface damage morphology investigations of silicon under millisecond laser irradiation

Wang, X.; Zhu, Dexing; Shen, Zhonghua; Lü, Jian; Ni, Xiaowu

doi:10.1016/j.apsusc.2010.08.098

Cited by 19 publications

(4 citation statements)

References 13 publications

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“…Investigations of thermal damages have focused primarily on the ablation effect, such as ablation threshold and ablation morphology. [6][7][8] The material is usually assumed to be homogeneous and isotropic. Thermal stress, induced by inhomogeneous heating, has seldom been taken into account.…”

Section: Introductionmentioning

confidence: 99%

Slip on the surface of silicon wafers under laser irradiation: Scale effect

Jia¹,

Li²,

Zhou³

et al. 2017

Chinese Phys. B

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The slip mechanism on the surface of silicon wafers under laser irradiation was studied by numerical simulations and experiments. Firstly, the slip was explained by an analysis of the generalized stacking fault energy and the associated restoring forces. Activation of unexpected {110} slip planes was predicted to be a surface phenomenon. Experimentally, {110} slip planes were activated by changing doping concentrations of wafers and laser parameters respectively. Slip planes were {110} when slipping started within several atomic layers under the surface and turned into {111} with deeper slip. The scale effect was shown to be an intrinsic property of silicon.

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Section: Introductionmentioning

confidence: 99%

Slip on the surface of silicon wafers under laser irradiation: Scale effect

Jia¹,

Li²,

Zhou³

et al. 2017

Chinese Phys. B

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“…Materials processing can include, without being limited to, surface modification [1], cutting [2], welding [3], drilling [4] and peening [5]. Lasers are highly versatile, with different technologies being capable of emitting light at different wavelengths (including ultra-violet, visible and infrared [6,7]) as well as emitting light as either a constant beam or in pulses ranging from milliseconds to attoseconds [8,9]. For the purpose of rapid surface processing, the CO 2 laser offers two primary advantages; firstly it is an efficient laser source that is capable of operating as a continuous wave (cw) at high power, and secondly, CO 2 lasers emit light at a wavelength of approximately 10.6 μm, which is in the long-wavelength infra-red (LWIR) region.…”

Section: Introductionmentioning

confidence: 99%

High speed CO₂laser surface modification of iron/cobalt co-doped boroaluminosilicate glass and the impact on surface roughness, gloss and wettability

Hodgson¹,

Waugh²,

Gillett³

et al. 2016

Laser Phys. Lett.

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A preliminary study into the impact of high speed laser processing on the surface of iron and cobalt co-doped glass substrates using a 60 W continuous wave (cw) CO2 laser. Two types of processing, termed fill-processing and line-processing, were trialled. In fill-processed samples the surface roughness of the glass was found to increase linearly with laser power from an Sa value of 20.8 nm to 2.1 µm at a processing power of 54 W. With line processing, a more exponential-like increase was observed with a roughness of 4 µm at 54 W. The change in surface properties of the glass, such as gloss and wettability, have also been measured. The contact angle of water was found to increase after laser processing by up to 64°. The surface gloss was varied between 45 and 100 gloss units (GUs).

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“…The studies of laser drilling have been mainly devoted to the femtosecond laser and nanosecond laser, and very few studies relate to the millisecond laser. This is because the processing quality induced by the short-pulse laser is much higher than by the millisecond laser [2][3][4] . However, the laser energy is easily shielded and wasted due to air breakdown and plasma [5,6] .…”

mentioning

confidence: 99%

Stress damage process of silicon wafer under millisecond laser irradiation

Jia¹,

Zhang²,

Zhu³

et al. 2018

Chin. Opt. Lett.

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The stress damage process of a single crystal silicon wafer under millisecond laser irradiation is studied by experiments and numerical simulations. The formation process of low-quality surface is monitored in real-time. Stress damage can be observed both in laser-on and -off periods. Plastic deformation is responsible for the first stress damage in the laser-on period. The second stress damage in the laser-off period is a combination of plastic deformation and fracture, where the fundamental cause lies in the residual molten silicon in the ablation hole.

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Surface damage morphology investigations of silicon under millisecond laser irradiation

Cited by 19 publications

References 13 publications

Slip on the surface of silicon wafers under laser irradiation: Scale effect

Slip on the surface of silicon wafers under laser irradiation: Scale effect

High speed CO₂laser surface modification of iron/cobalt co-doped boroaluminosilicate glass and the impact on surface roughness, gloss and wettability

Stress damage process of silicon wafer under millisecond laser irradiation

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Surface damage morphology investigations of silicon under millisecond laser irradiation

Cited by 19 publications

References 13 publications

Slip on the surface of silicon wafers under laser irradiation: Scale effect

Slip on the surface of silicon wafers under laser irradiation: Scale effect

High speed CO2laser surface modification of iron/cobalt co-doped boroaluminosilicate glass and the impact on surface roughness, gloss and wettability

Stress damage process of silicon wafer under millisecond laser irradiation

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High speed CO₂laser surface modification of iron/cobalt co-doped boroaluminosilicate glass and the impact on surface roughness, gloss and wettability