Surface defects during microcutting

Size effect and minimum chip thickness in micromilling

“…According to Simoneau et al [21], dimples take place in the direction of cutting at hard/soft grain boundaries of pearlite-ferrite microstructures as a result of plastic dissipation energy during the chip formation process. A large amount of cutting energy is absorbed by softer grains (ferrite) which deform plastically at the grain boundary before producing microcavities.…”

Microscopic phase-dependent residual stresses in the machined surface layer of two-phase alloy

“…1 (Sasahara and Obikawa, 1998). These days, this type of modeling based on alloy phases and microstructures is much more important than before because of miniaturization of machined parts (Simoneau et al, 2006).…”

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

“…The material properties, such as the crystallographic orientation [138,148,174], grain size [175], grain boundary [147,176,177], or hard particles [178][179][180] of or in workpiece material, have important effects on the cutting process. Therefore, in this section, the influence of the material properties would be discussed in three aspects: the influence of ductile materials, the influence of brittle materials and the influence of the defects, such as grain size, grain boundary and hard particle, on the micro/nanocutting process.…”

“…The processing force would vary as the tool passed the grain boundaries [182]. Simoneau et al [176] found that surface dimples occur at the hard to soft grain boundaries but do not occur when cutting through soft to hard grain boundaries. The dimples could be reduced by sizing the grain structure appropriately to the cutting parameters and specially the UCT.…”