“…TiO 2 has been well known because of its important roles in catalytic activity, occurrence of the strong metal-support interaction, oxide growth rates in electrochemical cells, and so on [4,5]. Surface defects can be created by thermal annealing in UHV [6,7], evaporation of excess Ti [8,9], Ar + sputtering [6,7,10,11], electron stimulated desorption (ESD) [4,11], and ultraviolet (UV) photo-stimulated desorption (PSD) [12,13]. It is well established that thermal annealing in UHV usually creates relatively small quanti-ties of point defects (reduced Ti(Ti 3+ )), whereas, Ar + sputtering can produce much higher quantities of defects with mixed Ti oxidation states (Ti 3+ , Ti 2+ , and Ti + ).…”