Surface engineering of 2D dielectric polymer films for scalable production of High-Energy-Density films

Yang, Minhao; Li, Qingmin; Zhang, Xianming; Bilotti, Emiliano; Zhang, Chong; Xu, C.; Gan, Shenghua; Dang, Zhi‐Min

doi:10.1016/j.pmatsci.2022.100968

Cited by 60 publications

(30 citation statements)

References 188 publications

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“…Ever‐increasing miniaturization of the capacitors to reduce their volume, weight, and cost urgently requires high‐quality scalable ultrathin flexible high‐temperature dielectric films [ 13–15 ] with concurrent high discharge energy density. [ 9,10,12,15–21 ] However, preparing high‐quality scalable ultrathin dielectric films remains challenging for high‐temperature dielectric energy storage films.…”

Section: Introductionmentioning

confidence: 99%

“…Techniques to fabricate high‐quality and reliable thin dielectric films mainly involve spin coating, [ 36,37 ] melt‐extrusion, [ 6,13,32 ] electrospinning, [ 38 ] and solution casting. [ 3,22–31 ] Melt‐extrusion is an economical nonsolvent commercial method and can fabricate high‐quality thin film less than 5 µm, for example, 2.2 µm for BOPP; however, the equipment is quite expensive.…”

Section: Introductionmentioning

confidence: 99%

“…[9,10,12,33] In addition, enhancements in the discharge energy density of high-temperature dielectrics suffer from increased conduction loss from nonlinear increases in electrical conduction induced by much improved hot charge carrier excitation, injection, and transport assisted by thermal and electric extremes. [3,34,35] Techniques to fabricate high-quality and reliable thin dielectric films mainly involve spin coating, [36,37] melt-extrusion, [6,13,32] electrospinning, [38] and solution casting. [3,[22][23][24][25][26][27][28][29][30][31] Melt-extrusion is an economical nonsolvent commercial method and can fabricate high-quality thin film less than 5 µm, for example, 2.2 µm for BOPP; however, the equipment is quite expensive.…”

mentioning

confidence: 99%

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including inverters in electric vehicles, [8,11] power electronics with integrated capacitors, aerospace power conditioning, and electric compressors for downhole oil and gas exploration. [12] Ever-increasing miniaturization of the capacitors to reduce their volume, weight, and cost urgently requires high-quality scalable ultrathin flexible high-temperature dielectric films [13][14][15] with concurrent high discharge energy density. [9,10,12,[15][16][17][18][19][20][21] However, preparing high-quality scalable ultrathin dielectric films remains challenging for high-temperature dielectric energy storage films.

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confidence: 99%

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Scalable Ultrathin All‐Organic Polymer Dielectric Films for High‐Temperature Capacitive Energy Storage

et al. 2022

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The miniaturization of electronic devices and power systems for capacitive energy storage under harsh environments requires scalable high‐quality ultrathin high‐temperature dielectric films. To meet the need, ultrasonic spray‐coating (USC) can be used. Novel polyimides with a dipolar group, CF3 (F‐PI), and all‐organic composites with trace organic semiconductor can serve as models. These scalable high‐quality ultrathin films (≈2.6 and ≈5.2 µm) are successfully fabricated via USC. The high quality of the films is evaluated from the micro‐millimeter scale to the sub‐millimeter and above. The high glass transition temperature Tg (≈340 °C) and concurrent large bandgap Eg (≈3.53 eV) induced by weak conjugation from considerable interchain distance (≈6.2 Å) enable F‐PI to be an excellent matrix delivering a discharge energy density with 90% discharge efficiency Uη90 of 2.85 J cm−3 at 200 °C. Further, the incorporation of a trace organic semiconductor leads to a record Uη90 of ≈4.39 J cm−3 at 200 °C due to the markedly enhanced breakdown strength caused by deep charge traps of ≈2 eV. Also, a USC‐fabricated multilayer F‐PI foil capacitor with ≈85 nF (six layers) has good performance at 150 °C. These results confirm that USC is an excellent technology to fabricate high‐quality ultrathin dielectric films and capacitors.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

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confidence: 99%

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Scalable Ultrathin All‐Organic Polymer Dielectric Films for High‐Temperature Capacitive Energy Storage

et al. 2022

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“…More recently, the polymer dielectrics with optimized hierarchically layered structures has become an emerging approach to resolve the existing paradox between high ε r and high breakdown strength in single-layered dielectric films, which resulted in substantial improvement in their capacitive energy storage performance. It is demonstrated that the electric field distribution, breakdown strength and capacitive performance can be readily adjusted by systematically varying the interfaces, chemical structures and ratios of the constituent layers ( Qiao et al, 2018 ; Hu et al, 2020 ; Wei and Zhu, 2020 ; Feng M. et al, 2021 ; Feng et al, 2022 ; Wu et al, 2022 ; Yang et al, 2022 ).…”

Section: Introductionmentioning

confidence: 99%

Controllable synthesis and structural design of novel all-organic polymers toward high energy storage dielectrics

Gong

Cheng

et al. 2022

Front. Chem.

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As the core unit of energy storage equipment, high voltage pulse capacitor plays an indispensable role in the field of electric power system and electromagnetic energy related equipment. The mostly utilized polymer materials are metallized polymer thin films, which are represented by biaxially oriented polypropylene (BOPP) films, possessing the advantages including low cost, high breakdown strength, excellent processing ability, and self-healing performance. However, the low dielectric constant (εr < 3) of traditional BOPP films makes it impossible to meet the demand for increased high energy density. Controlled/living radical polymerization (CRP) and related techniques have become a powerful approach to tailor the chemical and physical properties of materials and have given rise to great advances in tuning the properties of polymer dielectrics. Although organic-inorganic composite dielectrics have received much attention in previous studies, all-organic polymer dielectrics have been proven to be the most promising choice because of its light weight and easy large-scale continuous processing. In this short review, we begin with some basic theory of polymer dielectrics and some theoretical considerations for the rational design of dielectric polymers with high performance. In the guidance of these theoretical considerations, we review recent progress toward all-organic polymer dielectrics based on two major approaches, one is to control the polymer chain structure, containing microscopic main-chain and side-chain structures, by the method of CRP and the other is macroscopic structure design of all-organic polymer dielectric films. And various chemistry and compositions are discussed within each approach.

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High‐Temperature Energy Storage Polymer Dielectrics for Capacitors

Xie,

Li,

Peng

et al. 2023

High Temperature Polymer Dielectrics

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Surface engineering of 2D dielectric polymer films for scalable production of High-Energy-Density films

Cited by 60 publications

References 188 publications

Scalable Ultrathin All‐Organic Polymer Dielectric Films for High‐Temperature Capacitive Energy Storage

Scalable Ultrathin All‐Organic Polymer Dielectric Films for High‐Temperature Capacitive Energy Storage

Controllable synthesis and structural design of novel all-organic polymers toward high energy storage dielectrics

High‐Temperature Energy Storage Polymer Dielectrics for Capacitors

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