Surface Finish Effects on High-Speed Signal Degradation

Wu, Xin; Cullen, D.P.; Brist, Gary; Ramahi, Omar M.

doi:10.1109/tadvp.2007.914962

Cited by 36 publications

(8 citation statements)

References 3 publications

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“…Thus signal losses are higher on boards using ENIG and ImSn, while immersion silver contributes little to signal loss. 27,28 Since OSP is an insulator, signal propagation through traces with an OSP finish travels through copper. However, although OSP has little effect on high-speed signal loss, its insulating properties may preclude its use in applications that require conductivity of surface contacts.…”

Section: Characteristics Of the Immersion Silver Board Surface Finishmentioning

confidence: 99%

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

Wang

Choubey

Azarian

et al. 2009

Journal of Elec Materi

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The worldwide transition to lead-free electronics has increased the usage of several lead-free pad finishes for electronic assembly manufacturers, including immersion silver, immersion tin, electroless nickel-immersion gold, and organic solderability preservatives. This study assesses and compares immersion silver as a circuit board finish in terms of its ease of use, wettability, solderability, shelf life, appearance, solder joint strength, intermetallic and void formation, reliability, and costs.

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Section: Characteristics Of the Immersion Silver Board Surface Finishmentioning

confidence: 99%

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

Wang

Choubey

Azarian

et al. 2009

Journal of Elec Materi

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show abstract

“…This is mainly because of the electroless nickel immersion gold (ENIG) technology is used for the PCB surface plating. Its conductivity is lower than pure copper [12]. So compared with the simulation using pure copper, the actual conductor loss is higher.…”

Section: Resultsmentioning

confidence: 85%

A high performance ultra-wideband low cost SMA-to-GCPW transition

Wang

et al. 2016

IEICE Electron. Express

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This letter presents a novel low cost through-the-wall SMA connector and the transition structures from the SMA to a grounded coplanar waveguide (GCPW). The SMA connector has two short metal legs extended from the outer conductor used to reduce the discontinuity of the transition. The parameters of the GCPW are designed to match the geometry of the coaxial. A matching stub is introduced in the center conductor line to further improve the performance of the transition. A prototype device is developed and measured. The measurement results show the return loss of the proposed transition is better than 20 dB up to 26.5 GHz.

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“…degrading the failure risk of inner connection defect by setting a lower service time for drilling needles, turning down drilling speed and applying plasma desmear process; optimizing laminating and electroplating parameters to obtain better thickness uniformity of copper and dielectric, the accuracy of line width/pitch and layer-to-layer registration; mitigating the stub effect on signal integrity by applying an appropriate back-drilling technology; and selecting organic solderability preservatives or immersion silver as surface treatment when demanding a lower loss, while soldering reliability shall also be considered (Hsu et al, 2015;Wu et al, 2008).…”

Section: Manufacturing Process Requirementsmentioning

confidence: 99%

“…To satisfy the main technical specifications of 16∼24 layers with 2∼3 stages high-density interconnect, array holes with 0.4-mm pitch and thickness of 2.4∼3.0 mm on harder laminates with better chemical resistance for PCBs in the mm-wave application, more precision controlling procedures are required on manufacturing processes, which are summed up as follows: degrading the failure risk of inner connection defect by setting a lower service time for drilling needles, turning down drilling speed and applying plasma desmear process; optimizing laminating and electroplating parameters to obtain better thickness uniformity of copper and dielectric, the accuracy of line width/pitch and layer-to-layer registration; mitigating the stub effect on signal integrity by applying an appropriate back-drilling technology; and selecting organic solderability preservatives or immersion silver as surface treatment when demanding a lower loss, while soldering reliability shall also be considered (Hsu et al , 2015; Wu et al , 2008). …”

Section: Key Technical Demands On Pcb In 5g Mm-wave Applicationmentioning

confidence: 99%

Investigation on the new reliability issues of PCB in 5G millimeter wave application

He,

Huang,

Xiao

et al. 2023

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Purpose The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology. Design/methodology/approach The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test. Findings To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated. Originality/value The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

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Surface Finish Effects on High-Speed Signal Degradation

Cited by 36 publications

References 3 publications

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

A high performance ultra-wideband low cost SMA-to-GCPW transition

Investigation on the new reliability issues of PCB in 5G millimeter wave application

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