Surface-micromachined mirrors for laser-beam positioning

Tien, Norman C.; Solgaard, Olav; Kiang, Meng-Hsiung; Daneman, M.; Lau, Kam Y.; Muller, R.S.

doi:10.1016/0924-4247(96)80128-2

Cited by 53 publications

(15 citation statements)

References 4 publications

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“…et.al. [16] designed and fabricated movable micro mirrors with on-chip beam-steering devices for positioning and off-chip laser-beam scanning. They observed that micro mirrors are stable under temperature change and vibration.…”

Section: Micro Mirrorsmentioning

confidence: 99%

Advances in Development of MOEMS Devices: A Review

Joshi¹

2019

helix

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Micro-Opto-Electro-Mechanical Systems (MOEMS) are the combination of Micro-Electro-Mechanical Systems (MEMS) merged with Micro-optics. The precision workings of MEMS, its optical functionality, and fabrication techniques make possible a broad variety of movable and tunable mirrors, filters, and other optical structures. Microoptics has new features that are widely used in many applications than the classical optics. MOEMS contain movable components that have an effect on an optical signal that is pointed towards the surface of this optical component. In this paper, the focus is on MOEMS mirrors, filters, switches and few applications. Additionally, the emphasis is on finding the important and key issues for identification of scope for further work.

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Section: Micro Mirrorsmentioning

confidence: 99%

Advances in Development of MOEMS Devices: A Review

Joshi¹

2019

helix

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“…Out-of-plane microstructures offer a completely new design space to create devices that have advantages and capabilities previously not possible in ordinary planar structures. Out-of-plane microstructures have numerous applications in micro optical, thermal and RF systems [1][2][3]. They can provide thermal insulation from the substrate that is necessary for many transducers, and they can also add extra axes of sensitivity to the in-plane devices.…”

Section: Introductionmentioning

confidence: 99%

Stress anisotropy compensation of the sputter-deposited metal thin films by variable bias voltage

Khosraviani¹,

Leung²

2013

J. Micromech. Microeng.

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We introduce a new technique for compensating stress anisotropy across the thickness of sputter-deposited metal films. Our technique balances the film vertical stress gradient by altering the substrate bias during sputtering and by controlling the ion flux and energy that bombards the growing film. Sputter-deposited metal films are appealing materials for microfabrication of freestanding and out-of-plane structures, especially because of their low thermal budget. These microstructures extend the design space of micro-electro-mechanical systems (MEMS)-based devices, and they overcome some of the limitations of in-plane processing. Unfortunately, most elemental metals and alloys when sputter deposited have a substantial stress gradient across their thickness that can deteriorate their mechanical properties and severely distort the shape of the fabricated freestanding microstructures. The stress gradient across the thickness of a sputtered film can be compensated (balanced) by embedding a layer in the film with the opposite stress polarity compared to that of the bulk of the film. The force exerted by the stress mismatch between this layer and the bulk of the film easily overcomes the film's vertical stress gradient. This compensating force guarantees that a released freestanding structure remains flat and does not curl upward. This virtual layer is introduced to the growing film by altering the substrate bias voltage during the sputtering process. The substrate bias voltage controls the ion flux and energy that bombards the film, and it enables tailoring the film stress parameters. This technique has enabled us to fabricate freestanding microstructures up to 500 μm long with negligible stress-related deformation.

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“…To overcome the shortcomings of planar surface micromachining technologies, many researchers have developed assembly mechanisms over the last 20 years that take the thin, flat, in-plane components and assemble them into three-dimensional structures. In the past few years, the assembly of planar MEMS structures into out-of-plane systems has required integrated on-chip actuators [1,2] or complicated pick-and-place external robotic systems [3]. More recently, batch assembly techniques based on thermokinetic [4], centrifugal [5] and non-uniform residual stress [6] have been demonstrated, but require micromachined hinges [7] to allow the rotation of parts out-of-plane.…”

Section: Introductionmentioning

confidence: 99%

Lithographic stress control for the self-assembly of polymer MEMS structures

Lee

Sameoto

Mahanfar

et al. 2008

J. Micromech. Microeng.

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We present a novel self-assembly mechanism to produce an assortment of predetermined three-dimensional micromechanical structures in polymer MEMS technology using lithographically defined areas of stress and mechanical reinforcement within a single structural material. This self-assembly technology is based on the tensile stress that arises during the cross-linking of the negative tone, epoxy-based photoresist SU-8. Two different thicknesses of SU-8 are used in a single compliant structure. The first SU-8 layer forms the main structural element and the second SU-8 layer determines the aspects of self-assembly. The second SU-8 layer thickness acts to both to create a stress differential within the structure as well as define the direction in which the induced stress will cause the structure to deform. In this manner, both the magnitude and direction of self-assembled structures can be controlled using a single lithographic step. Although this technique uses a single structural material, the basic concept may be adapted for other processes, with different material choices, for a wide variety of applications.

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Surface-micromachined mirrors for laser-beam positioning

Cited by 53 publications

References 4 publications

Advances in Development of MOEMS Devices: A Review

Advances in Development of MOEMS Devices: A Review

Stress anisotropy compensation of the sputter-deposited metal thin films by variable bias voltage

Lithographic stress control for the self-assembly of polymer MEMS structures

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