Surface micromachined polysilicon accelerometer

Ristic, L.; Gutteridge, R.; Dunn, B. D.; Mietus, D.; Bennett, Paul

doi:10.1109/solsen.1992.228311

Cited by 39 publications

(15 citation statements)

References 16 publications

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“…As with most MEMS sensors, package interactions are just as critical as the selection of device technology, and often contribute to signifi cant performance variation between packages (Ristic et al , 1992). The packaging is vital, as it directly infl uences the fi nal characteristics of the product in terms of mechanical stress, shock transmission and so on, as well as its testability, reliability and cost.…”

Section: Packagingmentioning

confidence: 99%

MEMS sensors for automotive vehicle stability control applications

Reze¹,

Osajda²

2013

MEMS for Automotive and Aerospace Applications

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Section: Packagingmentioning

confidence: 99%

MEMS sensors for automotive vehicle stability control applications

Reze¹,

Osajda²

2013

MEMS for Automotive and Aerospace Applications

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“…For example, a vibratingring gyroscope uses lateral parallel-plate capacitors to null mechanical asymmetries in order to balance vibrational modes [90]; or the resonant frequency of a linear combdrive is adjusted by applying an electrostatic force to a triangularly shaped array of interdigitated tuning combdrives that engage the moving microstructure [91]. In some applications, such as accelerometers, the variation in mechanical properties of the sense element can be removed in the overall system calibration [92], [93]. Given the variety of options, cost-effective and stable means for trimming surface microstructures can be implemented.…”

Section: Trimmingmentioning

confidence: 99%

Surface micromachining for microelectromechanical systems

1998

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“…The capacitive imbalance is measured using charge integration [14][15][16] in response to a fixed voltage pulse applied to the sense capacitors. The interface front-end structure can then be implemented by using differential switched-capacitor techniques.…”

Section: Technology-driven Alternatives For Smart Sensor Interfacesmentioning

confidence: 99%

Technology‐Driven Alternatives for Smart Sensor Interfaces

Baschirotto

Malcovati

2003

Sensors Update

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The importance of integrated microsystems is continuously growing because of the combination of two trends: the progress of silicon sensor technology and the introduction of new techniques for interface circuits. In this chapter we show how different approaches to the implementation of smart sensor systems, basically driven by the available fabrication technologies, can lead to successful designs. Three examples are presented: a fully integrated current monitor, a biaxial accelerometer, and a rotational accelerometer. The current monitor is an example of single chip implementation. It supports two different operating ranges (20 A and 200 A full scale), provides digitally programmable gain and offset with an on-chip PROM, and achieves 9 bits of resolution and ± 0.6 LSB of linearity. The biaxial accelerometer and the rotational accelerometer are examples of implementations based on two chips in the same package. They achieve 80 dB of dynamic range with ±1 g full-scale signal over a 30 Hz bandwidth and 38 dB of dynamic range with 200 rad/s 2 full-scale signal over an 800 Hz bandwidth.

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Surface micromachined polysilicon accelerometer

Cited by 39 publications

References 16 publications

MEMS sensors for automotive vehicle stability control applications

MEMS sensors for automotive vehicle stability control applications

Surface micromachining for microelectromechanical systems

Technology‐Driven Alternatives for Smart Sensor Interfaces

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