2022
DOI: 10.3390/ma15165641
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Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon

Abstract: Chemical–mechanical polishing (CMP) is widely adopted as a key bridge between fine rotation grinding and ion beam figuring in super-smooth monocrystalline silicon mirror manufacturing. However, controlling mid- to short-spatial-period errors during CMP is a challenge owing to the complex chemical–mechanical material removal process during surface morphology formation. In this study, the nature of chemical and mechanical material removal during CMP is theoretically studied based on a three-system elastic–plasti… Show more

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Cited by 13 publications
(5 citation statements)
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“…Both sides of the Si wafer were mechanically polished (MP), obtaining optically specular surfaces. Finally, one side was finished by chemical mechanical polishing (CMP), obtaining an atomically flat defect-free surface [20]. Before their use, substrates were cleaned by acetone vapors to remove possible physical/chemical contaminants.…”
Section: Silicon Substratesmentioning
confidence: 99%
“…Both sides of the Si wafer were mechanically polished (MP), obtaining optically specular surfaces. Finally, one side was finished by chemical mechanical polishing (CMP), obtaining an atomically flat defect-free surface [20]. Before their use, substrates were cleaned by acetone vapors to remove possible physical/chemical contaminants.…”
Section: Silicon Substratesmentioning
confidence: 99%
“…The development of a friction model was necessary considering that the total friction, F f between the lower millstone, seeds, and upper millstone in the grinding process has three distinct friction force components [23,31].…”
Section: Friction Modelingmentioning
confidence: 99%
“…The development of a friction model was necessary considering that the total friction between the lower millstone, seeds, and upper millstone in the grinding process has three distinct friction force components [15,17].…”
Section: Friction Modelingmentioning
confidence: 99%