Surface Mounted Microstrip Antenna Using Ball Grid Array Packaging for Mmwave Systems Integration

Abstract

In this letter, two cost-effective surface-mount patch antenna elements for millimeter-wave (mmWave) systems using ball grid array (BGA) packaging are presented. A single-layer substrate based on FR4 is used to meet the low-cost requirements. The BGA packaging makes the proposed antenna element compact and easy to integrate. A U-slot is added to the patch to improve the impedance bandwidth of the patch antenna, and a vertical transition is designed to transmit the excitation signal by using a plated through-hole (PTH). The design process of the antenna is illustrated in detail. The antenna prototype has been simulated, fabricated, and measured to validate the design. The size of the fabricated prototype is 5 mm × 5 mm × 1.3 mm, which is very suitable for integration into a mmWave system.

Analysis of Super-Solar Integrated Patch Antenna for Sub-6 GHz and Beyond 6 GHz Millimeter Wave 5G Applications

“…To suit costeffective needs, an FR4 printed circuit board has recently been used as the substrate. Many low-cost mm-wave antennas [26][27][28][29][30][31][32] have been reported, including planar inverted-F antennas (PIFA) [28], U-shaped slot patch antennas [29], ball grid array (BGA) packaged ring slot antennas [30], BGA surface-mount bowtie antenna [31], and double-curved metal in multilayer printed circuit boards [32].…”