Surface oxide evolution on Al–Si bond wires for high-power RF applications

Qin, Wentao; Doyle, Ray; Scharr, T.A.; Shah, M.; Kottke, M.; Chen, G.; Theodore, D.

doi:10.1016/j.mee.2003.12.052

Cited by 13 publications

(3 citation statements)

References 7 publications

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“…Gold wires are the most widely employed in wire bonding, but Al-Si wires (Qin et al, 2004) and Cu wires are also used for interconnections in microelectronics devices. Copper wire is better than Au wire in terms of electrical conductivity, production cost, and resistance to wire sweeping (Ratchev et al, 2006).…”

Section: Wire Bonding and New Challengesmentioning

confidence: 99%

Wire bonding using insulated wire and new challenges in wire bonding

Zhong

2008

Microelectronics International

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Purpose -This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging. Design/methodology/approach -Dozens of journal articles, conference articles and patents published or issued in 2004-2007 are reviewed. Findings -The advantages and problems/challenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findings/developments related to wire bonding using insulated wire are discussed. Research limitations/implications -Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details. Originality/value -This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents.

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Section: Wire Bonding and New Challengesmentioning

confidence: 99%

Wire bonding using insulated wire and new challenges in wire bonding

Zhong

2008

Microelectronics International

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“…Copper is approximately 25% more conductive than gold, accounting for increased power rating and better heat dissipation. Higher electrical conductivity results in lowering the IC delay and less power loss [5]. Copper wires have higher tensile strength, lower wire sag, and better loop stability is obtained during encapsulation [6,7].…”

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confidence: 99%

Experimental and numerical investigations of the texture evolution in copper wire drawing

2012

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Polycrystalline copper wires are drawn in a single and multiple step for the equivalent area reduction (RA) of ∼33% The single step and multiple step drawing process was simulated using a rate independent crystal plasticity with finite strain, which is implemented as a user routine in commercial finite element package ABAQUS. The texture of the copper wires were characterized by X-ray diffraction (XRD) and compared with the texture based finite element (FE) simulation predictions. Initial 10 0 fiber decreases during the drawing process and is replaced by 1 1 1 fiber. The 1 1 1 oriented grains are predominant in a single step drawing compared to a multiple step of the equivalent area reduction. The finite element analysis takes into account active crystallographic slip and orientation effects during the drawing process. Regions at the interface of diewire exhibited complex textures, which was widely seen in the multiple step drawing pattern.

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Section: Introductionmentioning

confidence: 99%

Modeling of microstructure evolution during cold wire drawing process and properties determination

Narayanan¹

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Wire drawing is the most widely employed process for manufacturing the micrometer sized gold wire (φ10 − φ50 µm) used for electronic interconnects. Currently, gold wire is applied in the bonding pad and miniaturization has resulted in need of higher quality of wire; wire quality is dependent on mechanical properties. The mechanical properties are based on microstructural behavior. This work was performed during my Ph.D candidature at Nanyang Technological University, Singapore. This thesis would not have been possible without the cooperation and time of many people, whom I owe my deepest gratitude to. • My greatest thanks are reserved for my supervisor Associate Professor Sridhar Idapalapati whose help shall remain understated. His enthusiasm, inspiration and encouragement rubs off on students motivating us to perform better. His sound advice, constructive criticisms and his ability to explain things in a lucid manner shall always be remembered. • I would also like to thank Assistant Professor Sathyan Subbiah for co-advising this thesis. His efforts in guiding the thesis was amazing. It was an exorbitant privilege working with him. • My committee members Associate Professors Liu Er Jia, Tang Ming Jen and Assistant Professor Castagne Sylvie for overlooking my thesis work. • My special thanks to our subject librarian Mr. Ramaravikumar Ramakrishnan for providing me all the necessary resources for doing this Ph.D research. The library walk thru and ENDNOTE workshops were extremely helpful. His affable and risible attitude will always be remembered. • Thanks to Ms. Yong Mei Yoke for helping me with the SEM, Mr. Leong Kwok Phui for assisting me with the XRD and Dr. Zviad of the MSE school with the pole figure measurements. Mr. Teo Hai Beng for setting my LINUX cluster without which my simulations would never have happened.

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Surface oxide evolution on Al–Si bond wires for high-power RF applications

Cited by 13 publications

References 7 publications

Wire bonding using insulated wire and new challenges in wire bonding

Wire bonding using insulated wire and new challenges in wire bonding

Experimental and numerical investigations of the texture evolution in copper wire drawing

Modeling of microstructure evolution during cold wire drawing process and properties determination

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