Surface pretreatment by photo-irradiated chlorine dioxide radical for metallization of liquid crystal polymer dielectric materials

Manufacture of complex pattern flexible copper microcircuits based on silver seeds through chemical growth welding

“…Compared with the traditional flexible copper microcircuit based on liquid ink or laser reduction, the resistivity of 200-0.5-Ag/Cu also reached a matching value, and it was in the middle level. [13][14][15][16][17][18][19][20][21][22][23][24]55 Fig. 10(c) and (d) further validate this result with five LED lights in series.…”

“…It was close to the fatigue resistance of most flexible copper circuits. 16,19,22,24,55 This result demonstrated its fine potential for development in the field of flexible electronics.…”

“…Compared with the traditional flexible copper microcircuit based on liquid ink or laser reduction, the resistivity of 200-0.5-Ag/Cu also reached a matching value, and it was in the middle level. 13–24,55…”

“…[9][10][11][12] Therefore, the electroless plating at near room temperature shows unusual potential. [13][14][15][16][17][18][19][20][21][22][23] The chemical copper plating process generally involves three steps: the modification of flexible substrates, the reduction of catalytic seeds, and the growth of copper microcircuits. 16,18,[24][25][26] Chen et al 27 modified polyimide (PI) films using a strong alkaline solution, and subsequently printed Cu(II) ink and reductive ink respectively to form copper nanoparticle catalytic patterns.…”

Titanium dioxide modified by waste polyethylene terephthalate depolymerization monomer improves the dielectric properties and energy storage efficiency of epoxy resin

“…Currently, conventional dielectric materials still face some problems, including low flexibility, high cost, unfavorable miniaturization design and processing, and so forth, which restrict their wide application. In contrast, polymer dielectric materials 11–13 overcome the above drawbacks and show the advantages of low cost, excellent process capability, and high toughness. For example, as a polymer dielectric material with high electric resistance and heat resistance, epoxy resin (EP) has been widely used for capacitors, dielectric elastomers, and thin film transistors 14,15 .…”