Surface protection of copper by self assembled monolayer for low-temperature chip bonding

Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects

“…In fact, the contact angle of deionized water changed from 13.6 of the original surface to 99.4 of the SAM-coated surface. 19) It is also clearly seen from these comparative profiles that the increase in the intensity of O with preservation time was suppressed by the SAM coating.…”

“…After cleaning, approximately half of the sample pairs were treated by the SAM coating process. 19) The cleaning and coating processes are presented in Table I. Chemical solutions of H 2 SO 4 , KHSO 4 , and CH 3 COOH were sequentially used to remove surface contaminants, e.g., C and O, as investigation was performed by Auger electron spectroscopy (AES).…”